Patents by Inventor Michael Stumber

Michael Stumber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11873216
    Abstract: A method for producing damper structures on a micromechanical wafer. The method includes: (A) providing an edge adhesive film and a molding wafer, which includes a first side having a molding structure; (B) applying the edge adhesive film to the first side of the molding wafer at a low atmospheric pressure; (C) joining the edge adhesive film to the first side of the molding wafer by increasing the atmospheric pressure; (D) filling the molding structures with an adhesive; (E) curing the adhesive to form damper structures; (F) bonding the damper structures to a second side of a micromechanical wafer.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: January 16, 2024
    Assignee: ROBERT BOSCH GMBH
    Inventor: Michael Stumber
  • Patent number: 11505455
    Abstract: A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.
    Type: Grant
    Filed: November 29, 2019
    Date of Patent: November 22, 2022
    Assignee: Robert Bosch GmbH
    Inventors: Holger Hoefer, Klaus Offterdinger, Maximilian Amberger, Michael Stumber
  • Patent number: 11472698
    Abstract: A method for producing damper structures on a micromechanical wafer. The method includes: providing an at least partially UV-transparent master mold for molding damper structures; inserting and pressing a micromechanical wafer into the master mold so that micromechanical structures in the wafer are aligned in relation to the damper structures; filling the master mold with UV-curing LSR and subsequent UV irradiation; and mold release and removal of the connected structure of the micromechanical wafer with attached dampers. A method for producing a singulated MEMS chip comprising a UV-cured damper is also described.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: October 18, 2022
    Assignee: Robert Bosch GmbH
    Inventors: Michael Stumber, Stefan Apelt
  • Publication number: 20220024757
    Abstract: A method for producing damper structures on a micromechanical wafer. The method includes: (A) providing an edge adhesive film and a molding wafer, which includes a first side having a molding structure; (B) applying the edge adhesive film to the first side of the molding wafer at a low atmospheric pressure; (C) joining the edge adhesive film to the first side of the molding wafer by increasing the atmospheric pressure; (D) filling the molding structures with an adhesive; (E) curing the adhesive to form damper structures; (F) bonding the damper structures to a second side of a micromechanical wafer.
    Type: Application
    Filed: April 9, 2020
    Publication date: January 27, 2022
    Inventor: Michael Stumber
  • Publication number: 20210323810
    Abstract: A method for producing damper structures on a micromechanical wafer. The method includes: providing an at least partially UV-transparent master mold for molding damper structures; inserting and pressing a micromechanical wafer into the master mold so that micromechanical structures in the wafer are aligned in relation to the damper structures; filling the master mold with UV-curing LSR and subsequent UV irradiation; and mold release and removal of the connected structure of the micromechanical wafer with attached dampers. A method for producing a singulated MEMS chip comprising a UV-cured damper is also described.
    Type: Application
    Filed: April 5, 2021
    Publication date: October 21, 2021
    Inventors: Michael Stumber, Stefan Apelt
  • Publication number: 20210186373
    Abstract: An attachment device for a sample collection device for obtaining samples from exhaled respiratory air includes an inlet tube, a dip tube for discharging the respiratory air from the sample collection device, and at least a portion of a spiral path. The portion runs into an outlet opening which is designed to conduct the respiratory air to the sample collection device.
    Type: Application
    Filed: October 16, 2018
    Publication date: June 24, 2021
    Inventors: Michael Stumber, Veronika Schleper, Philipp Jung, Katrin Luckert
  • Publication number: 20210179422
    Abstract: A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.
    Type: Application
    Filed: November 29, 2019
    Publication date: June 17, 2021
    Inventors: Holger Hoefer, Klaus Offterdinger, Maximilian Amberger, Michael Stumber
  • Patent number: 10532162
    Abstract: A method for determining an injection process of an injection appliance includes injecting a fluid with the injection appliance and applying an electrical signal to at least one helical spring of the injection appliance coupled to a dosing wheel of the injection appliance. The method also comprises detecting an inductance value of the at least one helical spring. A number of windings of the at least one helical spring is dependent on a set rotation angle of the dosing wheel. The set rotation angle corresponds to a dose quantity of the fluid that is preselected for the injection process. The method moreover includes making available a determination signal representing the determined injection process, using the detected inductance value.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: January 14, 2020
    Assignee: Robert Bosch GmbH
    Inventors: Andreas Merz, Fabian Utermoehlen, Michael Stumber, Stefan Leidich
  • Patent number: 10035696
    Abstract: Measures are provided, by which mechanical stresses within the diaphragm structure of a MEMS component may be intentionally dissipated, and which additionally enable the implementation of diaphragm elements having a large diaphragm area in comparison to the chip area. The diaphragm element is formed in the layer structure of the MEMS component. It spans an opening in the layer structure and is attached via a spring structure to the layer structure. The spring structure includes at least one first spring component, which is oriented essentially in parallel to the diaphragm element and is formed in a layer plane below the diaphragm element. Furthermore, the spring structure includes at least one second spring component, which is oriented essentially perpendicularly to the diaphragm element. The spring structure is designed in such a way that the area of the diaphragm element is greater than the area of the opening which it spans.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: July 31, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Fabian Purkl, Michael Stumber, Ricardo Ehrenpfordt, Rolf Scheben, Benedikt Stein, Christoph Schelling
  • Patent number: 10000374
    Abstract: A layer material which is particularly suitable for the realization of self-supporting structural elements having an electrode in the layer structure of a MEMS component. The self-supporting structural element is at least partially made up of a silicon carbonitride (Si1-x-yCxNy)-based layer.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: June 19, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Christoph Schelling, Benedikt Stein, Michael Stumber
  • Patent number: 9936298
    Abstract: For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: April 3, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Thomas Buck, Fabian Purkl, Michael Stumber, Ricardo Ehrenpfordt, Rolf Scheben, Benedikt Stein, Christoph Schelling
  • Patent number: 9914636
    Abstract: A MEMS microphone component including at least one sound-pressure-sensitive diaphragm element is formed in the layer structure of the MEMS component, which spans an opening in the layer structure. The diaphragm element is attached via at least one column element in the central area of the opening to the layer structure of the component. The deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is implemented in the layer structure of the diaphragm element and is situated in the area of the attachment of the diaphragm element to the column element.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: March 13, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Thomas Buck, Fabian Purkl, Michael Stumber, Rolf Scheben, Benedikt Stein, Christoph Schelling
  • Publication number: 20170333637
    Abstract: A method for determining an injection process of an injection appliance includes injecting a fluid with the injection appliance and applying an electrical signal to at least one helical spring of the injection appliance coupled to a dosing wheel of the injection appliance. The method also comprises detecting an inductance value of the at least one helical spring. A number of windings of the at least one helical spring is dependent on a set rotation angle of the dosing wheel. The set rotation angle corresponds to a dose quantity of the fluid that is preselected for the injection process. The method moreover includes making available a determination signal representing the determined injection process, using the detected inductance value.
    Type: Application
    Filed: May 18, 2017
    Publication date: November 23, 2017
    Inventors: Andreas Merz, Fabian Utermoehlen, Michael Stumber, Stefan Leidich
  • Publication number: 20170247246
    Abstract: A layer material which is particularly suitable for the realization of self-supporting structural elements having an electrode in the layer structure of a MEMS component. The self-supporting structural element is at least partially made up of a silicon carbonitride (Si1-x-yCxNy)-based layer.
    Type: Application
    Filed: June 23, 2015
    Publication date: August 31, 2017
    Inventors: Christoph Schelling, Benedikt Stein, Michael Stumber
  • Patent number: 9621996
    Abstract: A micromechanical sound transducer system and a corresponding manufacturing method, in which the micromechanical sound transducer system includes a substrate having a front side and a back side, the substrate having a through opening extending between the back side and the front side, and a coil configuration on the front side having a coil axis, which runs essentially parallel to the front side, the coil configuration covering the through opening at least partially. Also provided is a magnet device, which is situated so as to allow for an axial magnetic flux to be generated through the coil configuration. The coil configuration has a winding device which has at least first winding sections made from at least one layer of a low-dimensional conductive material, the coil configuration being configured to inductively detect and/or generate sound.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: April 11, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Christoph Schelling, Michael Stumber, Benedikt Stein, Theresa Lutz, Rolf Scheben
  • Patent number: 9555229
    Abstract: A method for producing silicon microneedle arrays with drilled holes includes producing a silicon microneedle array. For each microneedle in a plurality of microneedles in the microneedle array, a laser is positioned relative to a microneedle and a drilled hole is drilled into the microneedle array by laser drilling. The drilled holes are drilled in microneedles, in flanks of the microneedles or alongside microneedles. A microneedle array includes a substrate composed of a micromechanical semiconductor material. The microneedle array has microneedles that project from the substrate and has drilled holes. The microneedles are composed of a porous micromechanical semiconductor material.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: January 31, 2017
    Assignee: Robert Bosch GmbH
    Inventor: Michael Stumber
  • Patent number: 9556476
    Abstract: A method for active hybridization in microarrays includes pumping an already prepared sample through a denaturing unit with a microarray and then through a reaction region which is spatially separate from the denaturing unit. The denatured reactive sample components are hybridized in the reaction region.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: January 31, 2017
    Assignee: Robert Bosch GmbH
    Inventors: Michael Stumber, Martina Daub, Jochen Rupp
  • Publication number: 20170026754
    Abstract: For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.
    Type: Application
    Filed: July 15, 2016
    Publication date: January 26, 2017
    Inventors: Thomas Buck, Fabian Purkl, Michael Stumber, Ricardo Ehrenpfordt, Rolf Scheben, Benedikt Stein, Christoph Schelling
  • Publication number: 20170022047
    Abstract: Measures are provided, by which mechanical stresses within the diaphragm structure of a MEMS component may be intentionally dissipated, and which additionally enable the implementation of diaphragm elements having a large diaphragm area in comparison to the chip area. The diaphragm element is formed in the layer structure of the MEMS component. It spans an opening in the layer structure and is attached via a spring structure to the layer structure. The spring structure includes at least one first spring component, which is oriented essentially in parallel to the diaphragm element and is formed in a layer plane below the diaphragm element. Furthermore, the spring structure includes at least one second spring component, which is oriented essentially perpendicularly to the diaphragm element. The spring structure is designed in such a way that the area of the diaphragm element is greater than the area of the opening which it spans.
    Type: Application
    Filed: July 19, 2016
    Publication date: January 26, 2017
    Inventors: Fabian PURKL, Michael Stumber, Ricardo Ehrenpfordt, Rolf Scheben, Benedikt Stein, Christoph Schelling
  • Publication number: 20170022046
    Abstract: A MEMS microphone component including at least one sound-pressure-sensitive diaphragm element is formed in the layer structure of the MEMS component, which spans an opening in the layer structure. The diaphragm element is attached via at least one column element in the central area of the opening to the layer structure of the component. The deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is implemented in the layer structure of the diaphragm element and is situated in the area of the attachment of the diaphragm element to the column element.
    Type: Application
    Filed: July 18, 2016
    Publication date: January 26, 2017
    Inventors: Thomas BUCK, Fabian Purkl, Michael Stumber, Rolf Scheben, Benedikt Stein, Christoph Schelling