Patents by Inventor Michael Sweda

Michael Sweda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low stress, tolerance free method for mounting power devices
    Patent number: 4631819
    Abstract: A low stress, tolerance free method for mounting a power device to a heat sink is disclosed. The power device is soldered into a break-away area created on a printed circuit (PC) board which is separated from the main PC board prior to final assembly. The main PC board may be mounted in a housing using any suitable means and the power device may be affixed to a heat sink regardless of tolerance build up so long as sufficient "travel" is created in the jumper wires which couple the break-away PC board to the main PC board.
    Type: Grant
    Filed: May 29, 1985
    Date of Patent: December 30, 1986
    Assignee: Motorola, Inc.
    Inventors: David D. Lasier, John L. Meyer, Michael Sweda