Patents by Inventor Michael T. Babin, SR.

Michael T. Babin, SR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11615807
    Abstract: The present disclosure is generally related to a tape head assembly narrower than the width of a tape, wherein the tape head assembly comprises one or more heads, wherein each of the one or more heads comprise a curved surface comprising a first beveled wing, a second beveled wing, and a flat-lapped surface disposed between the first beveled wing and the second beveled wing. The first beveled wing and the second beveled wing each comprise outer corners recessed from a top surface of the flat-lapped surface such that there is no interaction between the outer corners of the beveled wings and the tape.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: March 28, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: Robert G. Biskeborn, Oscar J. Ruiz, Kenji Kuroki, Michael T. Babin, Sr., Eduardo Torres
  • Publication number: 20170374744
    Abstract: In some examples, a method may include coupling a printed board assembly (PBA) to a fixture. In some examples, the PBA may include a printed board and a plurality of components that are electrically and mechanically coupled to the printed board, where each of the plurality of components defines a respective surface. The method may further include planarizing at least one of the respective surfaces of the plurality of components using an abrasive tool. The method may further include attaching a heat sink to the respective surfaces of the plurality of components. A system for planarizing surfaces of components attached to printed boards is also described.
    Type: Application
    Filed: September 6, 2017
    Publication date: December 28, 2017
    Inventor: Michael T. Babin, SR.
  • Publication number: 20160081196
    Abstract: In some examples, a method may include coupling a printed board assembly (PBA) to a fixture. In some examples, the PBA may include a printed board and a plurality of components that are electrically and mechanically coupled to the printed board, where each of the plurality of components defines a respective surface. The method may further include planarizing at least one of the respective surfaces of the plurality of components using an abrasive tool. The method may further include attaching a heat sink to the respective surfaces of the plurality of components. A system for planarizing surfaces of components attached to printed boards is also described.
    Type: Application
    Filed: September 16, 2014
    Publication date: March 17, 2016
    Inventor: Michael T. Babin, SR.
  • Publication number: 20140295740
    Abstract: A system according to one embodiment includes a substrate having one or more sacrificial row bars and one or more additional row bars, wherein the one or more sacrificial row bars comprise a wear resistant material and are adapted to be used in a lapping process to prepare a lapping plate, wherein the one or more additional row bars comprise a material that has less wear resistance than the wear resistant material and are adapted to be used for magnetic head slider production, and wherein the lapping plate is adapted to be used in a lapping process to polish the one or more additional row bars.
    Type: Application
    Filed: March 26, 2013
    Publication date: October 2, 2014
    Applicant: HGST Netherlands B.V.
    Inventors: Luis David G. Aguirre, Michael T. Babin, SR., Dorcas G. L. Flavier, Liwanag T. Garbo, Juan F. C. Nuno