Abstract: Grooves are formed on an exterior surface of a component. The grooves are formed proximate to one another such that the grooves diffract light. The exterior surface is processed to reduce the sharpness of peaks between the grooves, reduce differences between the peaks and valleys of the grooves, and/or roughen the grooves. The processing reduces diffraction caused by the grooves such that light reflected from the grooves is not substantially color-shifted (e.g., is or is near the color of the reflecting surface). In various implementations, the processing may include dry blasting, etching, abrasive blasting, burnishing, grinding, ablation, an/or any other process capable of reducing the sharpness, reducing the differences, and/or roughening the surface. In implementations where dry blasting is used, the dry blasting may use ceramic beads as a blast material.

Abstract: Embodiments are directed to a wearable device including first and second band straps attached to a device body. A buckle mechanism is configured to attach the first band strap to the second band strap and includes a spring bar attached to an end of the first band strap and a buckle loop engaged to the spring bar. A tang is configured to engage a hole formed in the second band strap to secure the first band strap to the second band strap. The tang defines an aperture that receives the spring bar and is configured to pivot about an offset axis that is offset with respect to an axis of the bar. As the tang is rotated, a restoring force biases the tang toward the buckle loop.

Abstract: A manufacturing system is provided. The manufacturing system may include a manufacturing apparatus and a dispensing apparatus. The dispensing apparatus may be configured to dispense a support material to act as a temporary fixture to support a component during manufacturing operations conducted thereon. The dispensing apparatus may dispense the support material in a liquid phase, and the support material may thereafter transition to a solid phase to support the component. After completion of the manufacturing operations, the component may be returned to the dispensing apparatus, wherein the component may be dipped in a heat transfer fluid that may cause the support material to transition back to the liquid phase for reuse. Related apparatuses and methods are also provided.

Abstract: Embodiments are directed to a wearable device including first and second band straps attached to a device body. A buckle mechanism is configured to attach the first band strap to the second band strap and includes a spring bar attached to an end of the first band strap and a buckle loop engaged to the spring bar. A tang is configured to engage a hole formed in the second band strap to secure the first band strap to the second band strap. The tang defines an aperture that receives the spring bar and is configured to pivot about an offset axis that is offset with respect to an axis of the bar. As the tang is rotated, a restoring force biases the tang toward the buckle loop.

Abstract: Frames for plug connectors capable of being a reduced size may include features to support contacts, house circuitry for coupling with the contacts, facilitate the flow of molten material during the molding of the frame, and allow for ease of insertion and removal of the plug connector to and from a corresponding receptacle connector. For example, a frame may include ledges, interlocks, and rounded and tapered openings. Methods for manufacturing the frame are also provided.

Abstract: A manufacturing system is provided. The manufacturing system may include a manufacturing apparatus and a dispensing apparatus. The dispensing apparatus may be configured to dispense a support material to act as a temporary fixture to support a component during manufacturing operations conducted thereon. The dispensing apparatus may dispense the support material in a liquid phase, and the support material may thereafter transition to a solid phase to support the component. After completion of the manufacturing operations, the component may be returned to the dispensing apparatus, wherein the component may be dipped in a heat transfer fluid that may cause the support material to transition back to the liquid phase for reuse. Related apparatuses and methods are also provided.

Abstract: Frames for plug connectors capable of being a reduced size may include features to support contacts, house circuitry for coupling with the contacts, facilitate the flow of molten material during the molding of the frame, and allow for ease of insertion and removal of the plug connector to and from a corresponding receptacle connector. For example, a frame may include ledges, interlocks, and rounded and tapered openings. Methods for manufacturing the frame are also provided.