Abstract: A method of teaching bonding locations of a semiconductor device on a wire bonding machine is provided. The method includes (1) providing the wire bonding machine with position data for (a) bonding locations of a first component of the semiconductor device, and (b) bonding locations of a second component of the semiconductor device; and (2) teaching the bonding locations of the first component of the semiconductor device and the second component of the semiconductor device using a pattern recognition system of the wire bonding machine to obtain more accurate position data for at least a portion of the bonding locations of the first component and the second component. The teaching step is conducted by teaching the bonding locations in the order in which they are configured to be wire bonded on the wire bonding machine.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: Apparatus and a method for determining the position of a component held on the end of a pick up tool includes a pick up tool and positioning sensing system mounted on a movable frame with each other. The position sensing system includes an adjustable light source for producing an intense fan of light onto a collimating lens. The collimating lens produces an object field comprising a thin wide sheet of collimated light to be projected on a component held by the pick up tool. The thin wide sheet of light is projected on a component whose position is to be determined and the unblocked rays of light are projected onto an objective focusing lens which focuses the unblocked light through a very small aperture onto a relay lens which receives the refocused unblocked rays of light and produces refocused collimated light rays which are directed as an image onto a linear array sensor having a plurality of high density pixel sensors whose position is known relative to the pick up tool.