Patents by Inventor Michael T. Hofflander

Michael T. Hofflander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180061442
    Abstract: A stainless steel dual stage actuated disk drive head suspension baseplate including a plated electrical contact area having nickel and gold. The baseplate can be heat treated. The nickel and gold can be in a mixture.
    Type: Application
    Filed: November 6, 2017
    Publication date: March 1, 2018
    Inventors: Jeffry S. Bennin, Jacob D. Bjorstrom, Shawn P. Bopp, Reed T. Hentges, Michael T. Hofflander, Richard R. Jenneke, Craig A. Leabch, Mark S. Lewandowski, Zachary A. Pokornowski, Brian D. Schafer, Brian J. Stepien, John A. Theget, John E. Theisen, John L. Wagner
  • Patent number: 9812160
    Abstract: A stainless steel dual stage actuated disk drive head suspension baseplate including a plated electrical contact area having nickel and gold. The baseplate can be heat treated. The nickel and gold can be in a mixture.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: November 7, 2017
    Assignee: Hutchinson Technology Incorporated
    Inventors: Jeffry S. Bennin, Jacob D. Bjorstrom, Shawn P. Bopp, Reed T. Hentges, Michael T. Hofflander, Richard R. Jenneke, Craig A. Leabch, Mark S. Lewandowski, Zachary A. Pokornowski, Brian D. Schafer, Brian J. Stepien, John A. Theget, John E. Theisen, John L. Wagner
  • Publication number: 20160104503
    Abstract: A stainless steel dual stage actuated disk drive head suspension baseplate including a plated electrical contact area having nickel and gold. The baseplate can be heat treated. The nickel and gold can be in a mixture.
    Type: Application
    Filed: December 18, 2015
    Publication date: April 14, 2016
    Inventors: Jeffry S. BENNIN, Jacob D. BJORSTROM, Shawn P. BOPP, Reed T. HENTGES, Michael T. HOFFLANDER, Richard R. JENNEKE, Craig A. LEABCH, Mark S. LEWANDOWSKI, Zachary A. POKORNOWSKI, Brian D. SCHAFER, Brian J. STEPIEN, John A. THEGET, John E. THEISEN, John L. WAGNER
  • Patent number: 9245555
    Abstract: Stable, low resistance conductive adhesive ground connections between motor contacts and a gold-plated contact area on a stainless steel component of a dual stage actuated suspension. The stainless steel component can be a baseplate, load beam, hinge, motor plate, add-on feature or flexure.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: January 26, 2016
    Assignee: Hutchinson Technology Incorporated
    Inventors: Jeffry S. Bennin, Jacob D. Bjorstrom, Shawn P. Bopp, Reed T. Hentges, Michael T. Hofflander, Richard R. Jenneke, Craig A. Leabch, Mark S. Lewandowski, Zachary A. Pokornowski, Brian D. Schafer, Brian J. Stepien, John A. Theget, John E. Theisen, John L. Wagner
  • Publication number: 20150055255
    Abstract: Stable, low resistance conductive adhesive ground connections between motor contacts and a gold-plated contact area on a stainless steel component of a dual stage actuated suspension. The stainless steel component can be a baseplate, load beam, hinge, motor plate, add-on feature or flexure.
    Type: Application
    Filed: November 3, 2014
    Publication date: February 26, 2015
    Inventors: Jeffry S. BENNIN, Jacob D. BJORSTROM, Shawn P. BOPP, Reed T. HENTGES, Michael T. HOFFLANDER, Richard R. JENNEKE, Craig A. LEABCH, Mark S. LEWANDOWSKI, Zachary A. POKORNOWSKI, Brian D. SCHAFER, Brian J. STEPIEN, John A. THEGET, John E. THEISEN, John L. WAGNER
  • Patent number: 8885299
    Abstract: Stable, low resistance conductive adhesive ground connections between motor contacts and a gold-plated contact area on a stainless steel component of a dual stage actuated suspension. The stainless steel component can be a baseplate, load beam, hinge, motor plate, add-on feature or flexure.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: November 11, 2014
    Assignee: Hutchinson Technology Incorporated
    Inventors: Jeffry S. Bennin, Jacob D. Bjorstrom, Shawn P. Bopp, Reed T. Hentges, Michael T. Hofflander, Richard R. Jenneke, Craig A. Leabch, Mark S. Lewandowski, Zachary A. Pokornowski, Brian D. Schafer, Brian J. Stepien, John A. Theget, John E. Theisen, John L. Wagner
  • Patent number: 5864445
    Abstract: An integrated lead disk drive suspension including a load beam and one or more conductive leads. The load beam has a mounting region on a proximal end, a head bonding platform on a distal end, and one or more spring regions connecting the head bonding platform to the mounting region. The conductive leads are integrated with and insulated from the load beam by an adhesive dielectric layer, and extend between the head bonding platform and the mounting region. The leads are adapted to reduce mechanical effects of the leads and/or dielectric layer on spring characteristics of the spring regions. One embodiment of the leads includes at least a first compensating portion which extends off the load beam and traverses a nonlinear path around at least a portion of one or more of the spring regions. In another embodiment the portions of the conductive leads extending between the distal end of the load beam and the head bonding platform are substantially free from the dielectric layer.
    Type: Grant
    Filed: December 20, 1996
    Date of Patent: January 26, 1999
    Assignee: Hutchinson Technology Incorporated
    Inventors: Jeffry S. Bennin, Todd W. Boucher, James H. Dettmann, Lloyd C. Goss, Gary E. Gustafson, Michael T. Hofflander, Brent D. Lien, Dean E. Myers
  • Patent number: 5844751
    Abstract: Laminate structures for attachment to a head suspension assembly in a hard disk drive. The laminate structures include a spring metal layer, a conductive layer, and an intermediate insulator/adhesive layer. The conductive layer can act as an interconnect assembly, as a gimbal, and as a spring region. The method of manufacture of the laminate structures incorporates manufacture of an interconnect assembly into the manufacture of spring structures such as a load beam or a gimbal. The laminate structures are manufactured by etching the layers from the outside in, using other layers as etching masks. Unique configurations are possible where either or both metal layers can be discontinuous, thanks to the manufacturing support of the second layer. The second layer can also be shaped into a plurality of panels, thus freeing the metal layers to act as the spring elements.
    Type: Grant
    Filed: April 19, 1996
    Date of Patent: December 1, 1998
    Assignee: Hutchinson Technology, Incorporated
    Inventors: Jeffry S. Bennin, Todd W. Boucher, James H. Dettmann, Lloyd C. Goss, Gary E. Gustafson, Michael T. Hofflander, Brent D. Lien, Dean E. Myers
  • Patent number: 5839193
    Abstract: Laminate structures for attachment to a head suspension assembly in a hard disk drive. The laminate structures include a spring metal layer, a conductive layer, and an intermediate insulator/adhesive layer. The conductive layer can act as an interconnect assembly, as a gimbal, and as a spring region. The method of manufacture of the laminate structures incorporates manufacture of an interconnect assembly into the manufacture of spring structures such as a load beam or a gimbal. The laminate structures are manufactured by etching the layers from the outside in, using other layers as etching masks. Unique configurations are possible where either or both metal layers can be discontinuous, thanks to the manufacturing support of the second layer. The second layer can also be shaped into a plurality of panels, thus freeing the metal layers to act as the spring elements.
    Type: Grant
    Filed: May 25, 1994
    Date of Patent: November 24, 1998
    Assignee: Hutchinson Technology Incorporated
    Inventors: Jeffry S. Bennin, Todd W. Boucher, James H. Dettmann, Lloyd C. Goss, Gary E. Gustafson, Michael T. Hofflander, Brent D. Lien, Dean E. Myers
  • Patent number: 5391842
    Abstract: An electrical head interconnect assembly is fabricated for installation upon the suspension member supporting a magnetic read/write head over a rotating storage disk of a magnetic disk drive. A head interconnect is comprised of a film carrier strip upon which conducting elements are positioned and bonded. The carrier strip can be of plastic, metallic, cellulosic, or composite construction. The conducting elements, fabricated of 1 or more twisted or parallel lengths, are routed along a prepatterned carrier strip defining the X, Y, and Z coordinate positioning required to mate with a suspension member without manual routing or manipulation. In addition, the conducting elements are fixedly spaced with stripped insulation at both termination points of the interconnect (electronics and head) allowing prepositioned, automatable bonding to connective pads. A suspension member positioned and bonded within the strip at appendage sites, completes the installation of the conducting elements upon the suspension.
    Type: Grant
    Filed: May 16, 1994
    Date of Patent: February 21, 1995
    Assignee: Hutchinson Technology, Inc.
    Inventors: Jeffry S. Bennin, Kevin D. Bjork, Todd W. Boucher, James H. Dettmann, Michael T. Hofflander
  • Patent number: 5370647
    Abstract: A tissue and organ extractor is provided for use during laparoscopic surgical procedures. The tissue and organ extractor has a handle, an elongated shank, and a flexible collapsible working end. The handle includes lock for locking a grasping instrument, such as forceps, securely in place in relation to the tissue and organ extractor. The extractor is inserted through a cannula into an abdominal cavity and the tissue or organ to be removed is manipulated into the working end by a grasping instrument. The extractor, grasping instrument and tissue are removed from the abdominal cavity through the cannula. The working end envelops the tissue and, during removal, compresses the enveloped tissue.
    Type: Grant
    Filed: May 13, 1993
    Date of Patent: December 6, 1994
    Assignee: Surgical Innovations, Inc.
    Inventors: John N. Graber, Michael T. Hofflander, Mark A. Schmidt