Patents by Inventor Michael T. Kocsik

Michael T. Kocsik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6043769
    Abstract: An absorber includes a plurality of shredded foam particles and a plurality of fiber whiskers. The fiber whiskers are interspersed among, and attach to the shredded foam particles to create a foam-fiber mixture. A curable adhesive is added to the foam-fiber mixture and the cured mixture is molded to form the radar absorber. The fiber whiskers are less than about two weight percent of the absorbers. The foam particles are preferably formed by shredding scrap foam. The particles are generally irregularly shaped and the size of the particles can be expressed as having a mean size of about 1/8" to 1" diameter, although the particles are not necessarily spherical. The fibers are about 1/8" to 3/4" in length and have a diameter of about 7.3 microns. To form the absorber, shredded foam particles are mixed with fiber whiskers, and the fiber whiskers attach themselves to the surface of the shredded foam particles.
    Type: Grant
    Filed: July 23, 1998
    Date of Patent: March 28, 2000
    Assignee: Cuming Microware Corporation
    Inventors: Paul E. Rowe, Michael T. Kocsik
  • Patent number: 5576710
    Abstract: An electromagnetic energy absorber provides a base having an electrically conductive ground plane positioned thereover. At least one dielectric and one impedance layer are positioned over the ground plane or surface on a side thereof opposite the base. An external most dielectric skin seals the structure. Additional alternating dielectric and impedance layers can be positioned over the first dielectric and impedance layers. The impedance layer, can be formed from a resistive sheet formed into a broken pattern that can comprise a series of geometric shapes spaced from each other. The broken pattern is sized to vary the specific impedance of the sheet. The resistive sheet can be combined with a series of composite dielectric layers to form an integral composite structure. Three resistive sheet layers can be provided with predetermined spacings from the ground surface and predetermined impedance to effect broadband absorption characteristics.
    Type: Grant
    Filed: June 16, 1994
    Date of Patent: November 19, 1996
    Assignee: Chomerics, Inc.
    Inventors: John F. Broderick, Noel J. Tessier, Michael S. Heafey, Michael T. Kocsik
  • Patent number: 5325094
    Abstract: An electromagnetic energy absorbing structure provides a base structure having an electrically conductive ground plane positioned thereover. At least one dielectric and one impedance layer are positioned over the ground plane or surface on a side thereof opposite the base. An external most dielectric skin seals the structure. Additional alternating dielectric and impedance layers can be positioned over the first dielectric and impedance layers. The dielectric layer can be constructed from syntactic foam with impedance layers formed from patterns of conductive dipoles. The impedance layer, can alternatively, be formed from a resistive sheet formed into a broken pattern that may comprise a series of geometric shapes spaced from each other. The resistive sheet can be combined with a series of composite dielectric layers to form an integral composite structure.
    Type: Grant
    Filed: May 15, 1992
    Date of Patent: June 28, 1994
    Assignee: Chomerics, Inc.
    Inventors: John F. Broderick, Noel J. Tessier, Michael S. Heafey, Michael T. Kocsik
  • Patent number: 5270364
    Abstract: Metallic fillers are provided which are stabilized against corrosion. The metallic fillers are stabilized by treating the surface of the filler particles wtih a triazole, preferably an aromatic triazole. This may be accomplished either by pretreating the filler with a solution of the triazole, or by adding the triazole to a polymeric composition containing a metallic filler.Polymeric compositions are further provided, e.g. compositions for microwave absorption, comprising a polymeric binder, a metallic filler and a triazole.
    Type: Grant
    Filed: September 24, 1991
    Date of Patent: December 14, 1993
    Assignee: Chomerics, Inc.
    Inventors: Kenneth K. Schwartz, Michael T. Kocsik