Abstract: The present invention relates to a device for cooling molded parts and for transporting the molded parts from a receiving position to a holding/ejecting position. The device of the present invention has particular utility with an index molding machine having a rotary turret block with at least two movable mold halves thereon. The cooling device includes a cooling station assembly having a plurality of blowing tubes for applying a cooling fluid to external surfaces of molded parts, a take-off plate having a plurality of holders for receiving cooled molded parts and a connecting plate connecting the take-off plate and the cooling station assembly. The connecting plate is connected to the take-off plate by a pivotable connection and is connected to the cooling station assembly by a rigid connection. The connecting plate is movable along an axis substantially parallel to one of the faces upon which the molded parts to be cooled and removed are positioned.