Patents by Inventor Michael T. W. De Langen

Michael T. W. De Langen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder-coating method, and solder paste suitable for use therein
    Patent number: 6423154
    Abstract: A method of solder-coating a metallic pad provided on a substrate, whereby at least the surface of the pad is provided with a deposit of solder paste, which paste comprises a suspension of metallic solder particles which, when molten, have a surface energy lower than the critical surface energy of the metallic pad but higher than the critical surface energy of the substrate surface outside the borders of the pad, whereby application of heat causes metallic solder particles within the paste lying upon the pad to melt and fuse together into an essentially continuous metallic solder layer, whereas the metallic solder particles within any paste lying upon the substrate surface outside the borders of the pad do not thus fuse together into a layer but are instead deposited as mutually-isolated solder beads, which beads can be subsequently removed from the substrate surface after completion of the heating process.
    Type: Grant
    Filed: January 11, 1996
    Date of Patent: July 23, 2002
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Johannes A. H. Van Gerven, Michael T. W. De Langen
  • Solder-coating method, and solder paste suitable for use therein
    Patent number: 5551628
    Abstract: A method of solder-coating a metallic pad provided on a substrate, whereby at least the surface of the pad is provided with a deposit of solder paste, which paste comprises a suspension of metallic solder particles which, when molten, have a surface energy lower than the critical surface energy of the metallic pad but higher than the critical surface energy of the substrate surface outside the borders of the pad, whereby application of heat causes metallic solder particles within the paste lying upon the pad to melt and fuse together into an essentially continuous metallic solder layer, whereas the metallic solder particles within any paste lying upon the substrate surface outside the borders of the pad do not thus fuse together into a layer but are instead deposited as mutually-isolated solder beads, which beads can be subsequently removed from the substrate surface after completion of the heating process.
    Type: Grant
    Filed: October 31, 1994
    Date of Patent: September 3, 1996
    Assignee: U.S. Philips Corporation
    Inventors: Johannes A. H. Van Gerven, Michael T. W. De Langen