Abstract: Aspects of the present disclosure relate to retrospective memory analysis. In examples, a historical archive of memory images for an execution environment is maintained. A historical memory image of the historical archive may be evaluated according to a current set of known issues, rather than issues that were known at the time of the memory capture. Accordingly, it may be possible to determine when the execution environment was last in a good environment condition. As another example, it may be possible to determine whether a now-known issue has since been resolved (e.g., such that the issue would not be identified in the current execution environment). Thus, as compared to contemporaneous issue identification techniques, aspects of the present disclosure may be applied to any number of execution environments to enable retrospective identification of now-known issues that were, at least at the time of a memory capture, not known.

Abstract: Processor-guided execution of offloaded instructions using fixed function operations is disclosed. Instructions designated for remote execution by a target device are received by a processor. Each instruction includes, as an operand, a target register in the target device. The target register may be an architected virtual register. For each of the plurality of instructions, the processor transmits an offload request in the order that the instructions are received. The offload request includes the instruction designated for remote execution. The target device may be, for example, a processing-in-memory device or an accelerator coupled to a memory.

Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.

Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.

Abstract: Aspects of the present disclosure relate to retrospective memory analysis. In examples, a historical archive of memory images for an execution environment is maintained. A historical memory image of the historical archive may be evaluated according to a current set of known issues, rather than issues that were known at the time of the memory capture. Accordingly, it may be possible to determine when the execution environment was last in a good environment condition. As another example, it may be possible to determine whether a now-known issue has since been resolved (e.g., such that the issue would not be identified in the current execution environment). Thus, as compared to contemporaneous issue identification techniques, aspects of the present disclosure may be applied to any number of execution environments to enable retrospective identification of now-known issues that were, at least at the time of a memory capture, not known.