Abstract: A system, a shelf, and a high density platform optimize the physical arrangement of cards to maximize cooling effectiveness and line card pitch while minimizing backplane trace lengths between line interface and switch fabric cards. The shelf and system and associated card arrangement supports scaling to a larger, double-size system that maintains the required length of backplane traces for card communications without compromising card cooling. Advantageously, the shelf and system maintains full NEBS compliance through an arrangement supporting full air intake/outtake through a front and/or back of the shelf or system, i.e. no side ventilation, and includes a false front to ensure all cards (switch fabric and line interface cards) are substantially flush with one another.

Abstract: A system, a shelf, and a high density platform optimize the physical arrangement of cards to maximize cooling effectiveness and line card pitch while minimizing backplane trace lengths between line interface and switch fabric cards. The shelf and system and associated card arrangement supports scaling to a larger, double-size system that maintains the required length of backplane traces for card communications without compromising card cooling. Advantageously, the shelf and system maintains full NEBS compliance through an arrangement supporting full air intake/outtake through a front and/or back of the shelf or system, i.e. no side ventilation, and includes a false front to ensure all cards (switch fabric and line interface cards) are substantially flush with one another.

Abstract: A system, a shelf, and a high density platform optimize physical arrangement of cards to maximize cooling effectiveness and line card pitch while minimizing backplane trace lengths between line interface and switch fabric cards. The shelf and system and associated card arrangement supports scaling to a larger, double size system that maintains the required length of backplane traces for card communications without compromising card cooling. Advantageously, the shelf and system maintains full NEBS compliance through an arrangement supporting full air intake/outtake through a front and/or back of the shelf or system, i.e. no side ventilation, and includes a false front to ensure all cards (switch fabric and line interface cards) are substantially flush with one another.

Abstract: A system, a shelf, and a high density platform optimize physical arrangement of cards to maximize cooling effectiveness and line card pitch while minimizing backplane trace lengths between line interface and switch fabric cards. The shelf and system and associated card arrangement supports scaling to a larger, double size system that maintains the required length of backplane traces for card communications without compromising card cooling. Advantageously, the shelf and system maintains full NEBS compliance through an arrangement supporting full air intake/outtake through a front and/or back of the shelf or system, i.e. no side ventilation, and includes a false front to ensure all cards (switch fabric and line interface cards) are substantially flush with one another.

Abstract: A method of electrical isolation for printed circuit board gasketing is disclosed for enabling gasketing to overlay plated through holes without shorting out thereto. The method of electrical isolation for printed circuit board gasketing includes counterboring at a controlled width to a controlled depth those plated through holes underlying the gasketing. The method provides the advantage of being able to overlay gasketing on both surfaces of a printed circuit board mid-plane. The method of electrical isolation for printed circuit board gasketing is particularly useful for overcoming the additional material requirements and processing steps of electrical isolation known in the art.

Abstract: A method of electrical isolation for printed circuit board gasketing is disclosed for enabling gasketing to overlay plated through holes without shorting out thereto. The method of electrical isolation for printed circuit board gasketing includes counterboring at a controlled width to a controlled depth those plated through holes underlying the gasketing. The method provides the advantage of being able to overlay gasketing on both surfaces of a printed circuit board mid-plane. The method of electrical isolation for printed circuit board gasketing is particularly useful for overcoming the additional material requirements and processing steps of electrical isolation known in the art.