Patents by Inventor Michael Taesch

Michael Taesch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Additive swept wedge buildup toolpath
    Patent number: 11292201
    Abstract: Systems and methods for designing and manufacturing an additive manufacturing (AM) model. A method includes computing a wedge plane and initial toolpath for an AMmodel based on a breaking angle. The method includes trimming an excess toolpath of the AM model using a breaking plane. The method includes building the toolpath along the normal of a first layer and trimming based on a next layer. The method includes building a next wedge of the toolpath in the direction of a wedge plane used to trim a previous wedge The method includes storing the toolpath.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: April 5, 2022
    Assignee: Siemens Industry Software Inc.
    Inventors: James Maynard, Michael Taesch, Timothy R. Fithian, William Vittitow, Mai-Anh T Bui, Ashish Joshi
  • ADDITIVE SWEPT WEDGE BUILDUP TOOLPATH
    Publication number: 20200004907
    Abstract: Systems and methods for designing and manufacturing an additive manufacturing (AM) model. A method includes computing a wedge plane and initial toolpath for an AMmodel based on a breaking angle. The method includes trimming an excess toolpath of the AM model using a breaking plane. The method includes building the toolpath along the normal of a first layer and trimming based on a next layer. The method includes building a next wedge of the toolpath in the direction of a wedge plane used to trim a previous wedge The method includes storing the toolpath.
    Type: Application
    Filed: September 5, 2018
    Publication date: January 2, 2020
    Inventors: James Maynard, Michael Taesch, Timothy R. Fithian, William Vittitow, Mai-Anh T Bui, Ashish Joshi