Patents by Inventor Michael Taufer

Michael Taufer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component and method for producing an electronic component
    Patent number: 11058005
    Abstract: An electronic component (E), including at least one circuit carrier (1), which is populated with a number of mechanical and/or electronic component parts (2 to 4) and has at least one contact opening (1.3) for forming a mechanical and/or electrical contact-connection point (KS) to at least one of the component parts (2 to 4), wherein at least one of the component parts (4) is at a distance from the circuit carrier (1), includes at least one electrically conductive housing (4.1) and at least one electrical contact element (4.2) projecting out of the housing (4.1), the contact element being insulated from the housing (4.1) and being connected at least in a materially bonded manner to the contact opening (1.3) of the circuit carrier (1), wherein at least one seal element (5) is arranged in the region of the contact-connection point (KS), in particular between the circuit carrier (1) and the housing (4) of the component part (4).
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: July 6, 2021
    Assignee: Vitesco Technologies Germany GmbH
    Inventors: Helmut Karrer, Peter Volkert, Michael Taufer, Konrad Härder
  • ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
    Publication number: 20200100364
    Abstract: An electronic component (E), including at least one circuit carrier (1), which is populated with a number of mechanical and/or electronic component parts (2 to 4) and has at least one contact opening (1.3) for forming a mechanical and/or electrical contact-connection point (KS) to at least one of the component parts (2 to 4), wherein at least one of the component parts (4) is at a distance from the circuit carrier (1), includes at least one electrically conductive housing (4.1) and at least one electrical contact element (4.2) projecting out of the housing (4.1), the contact element being insulated from the housing (4.1) and being connected at least in a materially bonded manner to the contact opening (1.3) of the circuit carrier (1), wherein at least one seal element (5) is arranged in the region of the contact-connection point (KS), in particular between the circuit carrier (1) and the housing (4) of the component part (4).
    Type: Application
    Filed: November 26, 2019
    Publication date: March 26, 2020
    Applicant: Vitesco Technologies Germany GMBH
    Inventors: Helmut Karrer, Peter Volkert, Michael Taufer, Konrad Härder