Abstract: A flexible electronic system comprises a flexible substrate comprising an interlayer elastomer dielectric and a plurality of rigid components disposed within the flexible substrate. The flexible electronic system may further comprise a high-density interconnect region comprising one or more routing layers. In examples, the flexible electronic system may further comprise a flexible barrier material encapsulating the flexible electronic system. In some examples the flexible electronic system and the high-density interconnect region may further comprise a plurality of routing layers and one or more through-vias. Each through-via may couple at least one of two rigid components, two routing layers, or a rigid component and a routing layer. In examples, at least some of the routing layers may comprise conductive traces.

Abstract: An example electrode configured to receive biometric signals is described herein. The electrode is constructed of a rigid structure coupled to electrical signal-processing components, wherein the electrical signal-processing components are configured to at least partially process received biometric signals. The electrode has a conductive deformable material that is adhered to the rigid structure and houses the electrical signal-processing components. The conductive deformable material is configured to deform while it is in contact with skin of a user. The conductive deformable material is also configured to: define an outer surface of the electrode that receives a biometric signal from the user, and provide the biometric signal to the electrical signal-processing components that are housed within the conductive deformable material for at least partially processing the biometric signal.