Abstract: A computerized tool or method that calculates the capacitance and resistance of each global wire on the chip, one wire at a time. The invention steps along a track containing a wire segment, grid point by grid point, calculating the resistance and capacitance at that point. At each grid point it searches the neighboring tracks within the surrounding cube for adjacent elements that could cause capacitive effects or affect the resistance of the wire. The method delivers capacitance and resistance values for each process condition for a grid unit length of wire, given the wire type and 3 dimensional environment of the wire segment. The capacitance and resistance at a grid point along the wire are generally determined by one table lookup for wire types based on the surrounding environment. These values are added along wire segments to deliver accurate 3 dimensional capacitances and resistances.