Abstract: A method of assessing discrepancy between a target value and a measured value of a parameter of contact area produced between flow of solder ejected from a nozzle and a surface is defined in the present application. This method comprises the steps of: providing a surface of material through which contact area between solder ejected from a nozzle and a side of the surface can be visually detected, for example using a camera; flowing solder through a nozzle and then bringing the solder into contact with a side of the surface, thereby creating contact area between the solder and said side of the surface; detecting the contact area from the other side of the surface so that a value of a parameter of said contact area can then be measured; and assessing any discrepancy between the target value and the measured value so that any necessary compensation in order to achieve the target value can be programmed.

Abstract: A method of assessing discrepancy between a target value and a measured value of a parameter of contact area produced between flow of solder ejected from a nozzle and a surface is defined in the present application. This method comprises the steps of: providing a surface of material through which contact area between solder ejected from a nozzle and a side of the surface can be visually detected, for example using a camera; flowing solder through a nozzle and then bringing the solder into contact with a side of the surface, thereby creating contact area between the solder and said side of the surface; detecting the contact area from the other side of the surface so that a value of a parameter of said contact area can then be measured; and assessing any discrepancy between the target value and the measured value so that any necessary compensation in order to achieve the target value can be programmed.

Abstract: A fluxer comprises a spray head (15), a reservoir (3) for the flux (9) and a feed line (11) for feeding flux from the reservoir (3) to the spray head (15) by pressurising the reservoir with an air supply via a line (7). A return (12) line is provided from the spray head (15) so that cleaning fluid (9?) can be fed from a reservoir (3?) via line (11) and returned to a waste reservoir (19). A spray head has an electromagnetically operated piston (53) for spraying flux. The piston (53) is biased to a first position by a spring (49) to close a spray outlet aperture (63) and is moved against the force of the spring (49) by the electromagnet (71).

Abstract: A selective soldering apparatus comprises a bath 3 for molten solder 5, a solder nozzle 19 and a pump 9 for pumping molten solder 5 through the nozzle 19. The nozzle has a nozzle body 21 with an inner bore 22 through which solder is pumped to overflow a nozzle outlet 33. A jacket 23 provided around the nozzle body 21 to form an enclosed space 26 open at its upper end 28 to solder which has overflowed from the nozzle outlet 33 and the cover lower end being adjacent the surface 11 of molten solder in the bath, wherein a spiral pathway 25 is provided in the enclosed space 26 so that the overflowed solder runs down the pathway into the solder bath 3. A port 39 is provided at the lower end of the jacket for gas to flow into or out of the spiral pathway so that the pathway can be purged of air when solder is not flowing through the pathway.

Abstract: In a dip soldering process, solder is pumped through a nozzle outlet. Leads of a component on a circuit board are dipped into the surface of the flowing solder to solder the leads to a track on the underside of the circuit board. To prevent solder bridging between the leads, a plate is provided below the solder surface, and passes between the leads. When withdrawing the leads from the solder, the solder surface is dropped to the level of the plate, so that excess solder is drawn away from the leads, preventing solder bridging between the leads. Member may be movable to rise through the solder surface as the circuit board is raised away from the surface.

Abstract: A soldering apparatus comprises a solder bath, a body positioned in the bath and having a plurality of main conduits for feeding solder from a solder pump to a nozzle or thimble. Each conduit communicates with a pump chamber and a conduit in a thimble plate on which the thimbles are mounted. The thimble plate is readily replaced by lifting the main body clear of the solder on lifting mechanisms. Thimbles can be positioned at any desired location on the plate, conduits being formed in the plate to lead from the outlet of a respective conduit.

Abstract: A multi-phase process fluid is passed through a vibratable flowtube. Motion is induced in the vibratable flowtube. A first apparent property of the multi-phase process fluid based on the motion of the vibratable flowtube is determined, and an apparent intermediate value associated with the multi-phase process fluid based on the first apparent property is determined. A corrected intermediate value is determined based on a mapping between the intermediate value and the corrected intermediate value. A phase-specific property of a phase of the multi-phase process fluid is determined based on the corrected intermediate value.

Abstract: A flowmeter is disclosed. The flowmeter includes a vibratable flowtube, and a driver connected to the flowtube that is operable to impart motion to the flowtube. A sensor is connected to the flowtube and is operable to sense the motion of the flowtube and generate a sensor signal. A controller is connected to receive the sensor signal. The controller is operable to determine a first flow rate of a first phase within a two-phase flow through the flowtube and determine a second flow rate of a second phase within the two-phase flow.

Abstract: A flowmeter is disclosed. The flowmeter includes a vibratable flowtube, and a driver connected to the flowtube that is operable to impart motion to the flowtube. A sensor is connected to the flowtube and is operable to sense the motion of the flowtube and generate a sensor signal. A controller is connected to receive the sensor signal. The controller is operable to determine an individual flow rate of each phase within a multi-phase flow through the flowtube.

Abstract: A method for calculating a property of a fluid includes inducing motion in a conduit such that the conduit oscillates in a first mode of vibration and a second mode of vibration. The first mode of vibration has a corresponding first frequency of vibration and the second mode of vibration has a corresponding second frequency of vibration. The conduit contains a fluid. The first frequency of vibration is determined, and the second frequency of vibration is determined. A property of the fluid based on the first frequency of vibration and the second frequency of vibration is calculated.

Abstract: Motion is induced in a conduit that contains a fluid. The motion is induced such that the conduit oscillates in a first mode of vibration and a second mode of vibration. The first mode of vibration has a corresponding first frequency of vibration and the second mode of vibration has a corresponding second frequency of vibration. At least one of the first frequency of vibration or the second frequency of vibration is determined. A phase difference between the motion of the conduit at a first point of the conduit and the motion of the conduit at a second point of the conduit is determined. A quantity based on the phase difference and the determined frequency is determined. The quality includes a ratio between the first frequency during a zero-flow condition and the second frequency during the zero-flow condition. A property of the fluid is determined based on the quantity.

Abstract: Motion is induced in a conduit that contains a fluid. The motion is induced such that the conduit oscillates in a first mode of vibration and a second mode of vibration. The first mode of vibration has a corresponding first frequency of vibration and the second mode of vibration has a corresponding second frequency of vibration. The first and the second frequencies vary with temperature. A first temperature that influences the first mode of vibration is determined and a second temperature that influences the second mode of vibration is determined. A property of the fluid is determined based on the first temperature and the second temperature such that the property is compensated for the first or second frequencies variation with temperature.

Abstract: A flowmeter is disclosed. The flowmeter includes a vibratable flowtube, and a driver connected to the flowtube that is operable to impart motion to the flowtube. A sensor is connected to the flowtube and is operable to sense the motion of the flowtube and generate a sensor signal. A controller is connected to receive the sensor signal. The controller is operable to determine a first flow rate of a first phase within a two-phase flow through the flowtube and determine a second flow rate of a second phase within the two-phase flow.

Abstract: A flowmeter is disclosed. The flowmeter includes a vibratable flowtube, and a driver connected to the flowtube that is operable to impart motion to the flowtube. A sensor is connected to the flowtube and is operable to sense the motion of the flowtube and generate a sensor signal. A controller is connected to receive the sensor signal. The controller is operable to determine an individual flow rate of each phase within a multi-phase flow through the flowtube.

Abstract: A flowmeter is disclosed. The flowmeter includes a vibratable flowtube, and a driver connected to the flowtube that is operable to impart motion to the flowtube. A sensor is connected to the flowtube and is operable to sense the motion of the flowtube and generate a sensor signal. A controller is connected to receive the sensor signal. The controller is operable to determine a first flow rate of a first phase within a two-phase flow through the flowtube and determine a second flow rate of a second phase within the two-phase flow.

Abstract: In a dip soldering process, solder is pumped through a nozzle outlet. Leads of a component on a circuit board are dipped into the surface of the flowing solder to solder the leads to a track on the underside of the circuit board. To prevent solder bridging between the leads, a plate is provided below the solder surface, and passes between the leads. When withdrawing the leads from the solder, the solder surface is dropped to the level of the plate, so that excess solder is drawn away from the leads, preventing solder bridging between the leads. Member may be movable to rise through the solder surface as the circuit board is raised away from the surface.

Abstract: In a soldering process leads of components on a circuit board are dipped into a solder bath to solder them to the underside of the board. The board is rotated about a horizontal axis as it is lifted away from the bath. This reduces the tendency to form solder bridges between closely spaced leads.

Abstract: In a soldering apparatus using a rotary station, a component holder is lowered and/or moved vertically by a stepper motor drive. A motor, lowers a drive shaft by a lead screw, and a second motor rotates the shaft via a toothed bearing wheel, the shaft having a hexagonal cross-section. A pivotable lobe couples the shaft to a shaft to lower the component holder and to rotate it (by rotation of shaft). The stepper motors allow for variable speed of vertical movement of the component holder and for selective rotation.

Abstract: A soldering apparatus includes a solder bath 40 and a component holder 43 positioned to lower an exposed tag of a component to contact solder in the solder bath 40. After removal from the bath the component is deliberately subjected to a mechanical shock when a limb of a bracket 44 strikes a turret plate 42 under the action of a spring 46. The shock causes a short time vibration in the component and spreads solder in tears which naturally form on the exposed tags to remove or substantially reduce those tears.

Abstract: A soldering apparatus comprises a solder bath, an applicator for applying solder to a joint or the like to be soldered and a pump for pumping solder substantially continuously through the applicator. The applicator is movable vertically relative to the solder bath to solder a joint positioned above the bath.