Abstract: An integral connectorless hermetically sealed high-temperature piezoelectric sensor housing and cable assembly includes signal conditioning/processing circuitry having a charge amplifier-differential amplifier combination with integral trim capacitor and/or a voltage divider network in at least one signal processing path to provide the ability to custom adjust input impedances and balance common-mode signals to compensate for inequalities caused by inherent parasitic capacitances and specific structural constraints of the sensor assembly.

Abstract: A sensor mount provides for attachment of a vibration sensor or other sensor to a machine without having to turn or rotate the sensor. In conjunction with a sensor module having an integral sensor and a shoulder formed at the outer periphery of the sensor module, the invention provides a coupler having a lower threaded portion for being threadingly engaged with a corresponding threaded recess formed in the machine. An externally threaded upper portion of the coupler remains exposed above the machine structure. A fastener is configured to attach the sensor module to the coupler by engaging the sensor module shoulder and the exposed upper portion of the coupler. The fastener may be captured to the sensor module or separable therefrom. When attached to a machine, the fastener and coupler are substantially symmetrically positioned with respect to a central axis of the sensor.