Abstract: A head unit system for a head of a user, including a headpiece including a support structure shaped to be worn over the head. A shield mount attached to the support structure is arranged for supporting a face shield adjacent to the head. A headpiece connector is attached to the support structure and has a headpiece contact configured for electrical connection. A peripheral device provided for being secured to the headpiece for concurrent movement, the peripheral device having a device connector with a device contact configured for electrical connection. The device connector and the headpiece connector cooperate to releasably attach the peripheral device to the headpiece in a secured configuration with the respective headpiece contact and the device contact abutting in the secured configuration so as to facilitate electrical connection between the headpiece and the peripheral device.

Abstract: A method for manufacturing a plurality of, in particular hermetically, sealed functional elements, comprising the following steps: providing a first wafer comprising the plurality of functional elements, providing a second wafer, applying a sealing material in the form of a plurality of frame structures on a first surface of the second wafer, placing the second wafer on the first wafer or vice versa, joining the first wafer with the second wafer.

Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.

Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.

Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.

Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.

Abstract: Embodiments are related generally to electronic displays and, more particularly, to emissive displays made with transparent sheets having phosphor dots on the surface for the purpose of color conversion.

Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.

Abstract: Embodiments are related generally to display fabrication, and more particularly to a fluidic assembly process for the placement of light emitting diodes on a transparent display substrate.

Abstract: A housing part for a strain sensor is described. The strain sensor includes at least one sensor element. The housing part includes an interior space for receiving the sensor element. The housing part includes a contract layer of electrically conducting material produced by way of thick film technology, the contact layer being intended for realization of an electrical feedthrough from the interior space to the outside.

Abstract: A method for checking an interface module, the interface module returning to the processor, using a second data message, stored values representing sensor values, after a request for a test by a processor using a data message. Using these firm sensor values, the processor can check the functioning of the interface module and its own algorithm. A safety module, which also picks up the sensor values, also checks its functioning with them, since the safety module is a redundant hardware path to the processor and is used as a plausibility check for the release decision of means of restraint. The interface module is changed into a test mode as soon as it receives the first data message from the processor, and it then suppresses the transmission of the real sensor values which were received from connected sensors.

Abstract: A sensor has a transmitter module for transferring data via a line, the sensor receiving power via the line. At a point in time in which the sensor receives a first power level, it transmits the data for a first time interval. A second sensor which is connected to the line in parallel to the first sensor then transmits its data for a second time interval after the first time interval. A timing sequence control system in the two sensors which is triggered by the point in time of reception of the power ensures the subsequent transmission by the first and second sensor.

Abstract: A method for transmitting data from at least one sensor to a control unit is described, a value range, which is available for encoding the data to be transmitted, being divided into three portions. The first portion is used for the sensor values. The second portion is used for status signals and error signals, and the third portion is used for sensor identification data, the three portions being separated from one another and following in succession.

Abstract: A baking oven containing a lighting device for lighting the cooking area and a lighting control device for controlling the on/off states and time profiles of the lighting device. The lighting control device has at least two pre-determined time profiles for determining the lighting intensity of the lighting device according to the operation leading to the switching on of the lighting device.