Abstract: In accordance with the present invention, there is provided a stent for insertion into a vessel of a patient. The stent is a tubular member having front and back open ends and a longitudinal axis extending there between. The tubular member has a first smaller diameter for insertion into a patient and navigation through the vessels, and a second larger diameter for deployment into the target area of a vessel. The tubular member is made from a plurality of adjacent hoops extending between the front and back ends. The hoops include a plurality of longitudinal struts and a plurality of loops connecting adjacent struts. The stent further includes a plurality of bridges having loop to bridge connections which connect adjacent hoops to one another. The bridge to loop connection points are separated angularly with respect to the longitudinal axis. The bridges have one end attached to a loop, another end attached to a loop on an adjacent hoop.

Abstract: Medical devices having bonded joints are disclosed. The bonded joints include two surfaces bonded by a layer of phenoxy resin therebetween. In the preferred embodiments, bonded surfaces include materials that are suitable for medical devices. Most preferably, Nitinol includes at least one bonded surface, however, other preferred materials may include, but are not limited to cobalt chromium, stainless steel, titanium, tantalum, and plastic. An intraluminal device including a plurality of locations with a phenoxy resin layer is also disclosed wherein the phenoxy resin further includes a radioopaque additive, a lubricious additive, or both radioopaque and lubricious additives. Also disclosed is an intraluminal device having contiguous heterogeneous structural elements of metallic members and non-metallic sections that are bonded together by a layer of phenoxy resin therebetween.

Abstract: Medical devices comprised of bonded joints are disclosed. The bonded joints comprise two surfaces bonded by a layer of phenoxy resin therebetween. In the preferred embodiments, bonded surfaces are comprised of materials that are suitable for medical devices. Most preferably, Nitinol comprises at least one bonded surface, however, other preferred materials may include, but are not limited to cobalt chromium, stainless steel, titanium, tantalum, and plastic. An intraluminal device comprised of a plurality of locations with a phenoxy resin layer is also disclosed wherein the phenoxy resin is further comprised of a radiopaque additive, a lubricious additive, or both radiopaque and lubricious additives. Also disclosed is an intraluminal device comprised of contiguous heterogeneous structural elements comprised of metallic members and non-metallic sections that are bonded together by a layer of phenoxy resin therebetween.

Abstract: In accordance with the present invention, there is provided a stent for insertion into a vessel of a patient. The stent is a tubular member having front and back open ends and a longitudinal axis extending there between. The tubular member has a first smaller diameter for insertion into a patient and navigation through the vessels, and a second larger diameter for deployment into the target area of a vessel. The tubular member is made from a plurality of adjacent hoops extending between the front and back ends. The hoops include a plurality of longitudinal struts and a plurality of loops connecting adjacent struts. The stent further includes a plurality of bridges having loop to bridge connections which connect adjacent hoops to one another. The bridge to loop connection points are separated angularly with respect to the longitudinal axis. The bridges have one end attached to a loop, another end attached to a loop on an adjacent hoop.

Abstract: Medical devices having bonded joints are disclosed. The bonded joints include two surfaces bonded by a layer of phenoxy resin therebetween. In the preferred embodiments, bonded surfaces include materials that are suitable for medical devices. Most preferably, Nitinol includes at least one bonded surface, however, other preferred materials may include, but are not limited to cobalt chromium, stainless steel, titanium, tantalum, and plastic. An intraluminal device including a plurality of locations with a phenoxy resin layer is also disclosed wherein the phenoxy resin further includes a radioopaque additive, a lubricious additive, or both radioopaque and lubricious additives. Also disclosed is an intraluminal device having contiguous heterogeneous structural elements of metallic members and non-metallic sections that are bonded together by a layer of phenoxy resin therebetween.

Abstract: Medical devices comprised of bonded joints are disclosed. The bonded joints comprise two surfaces bonded by a layer of phenoxy resin therebetween. In the preferred embodiments, bonded surfaces are comprised of materials that are suitable for medical devices. Most preferably, Nitinol comprises at least one bonded surface, however, other preferred materials may include, but are not limited to cobalt chromium, stainless steel, titanium, tantalum, and plastic. An intraluminal device comprised of a plurality of locations with a phenoxy resin layer is also disclosed wherein the phenoxy resin is further comprised of a radioopaque additive, a lubricious additive, or both radioopaque and lubricious additives. Also disclosed is an intraluminal device comprised of contiguous heterogeneous structural elements comprised of metallic members and non-metallic sections that are bonded together by a layer of phenoxy resin therebetween.

Abstract: In one embodiment, wafers are processed to build test structures in the wafers. The wafers may be processed in tools of process steps belonging to a process module. The test structures may be tested to obtain defectivity data. Tool process parameters may be monitored and collected as process tool data. Other information about the wafers, such as metrology data and product layout attribute, may also be collected. A model describing the relationship between the defectivity data and process tool data may be created and thereafter used to relate the process tool data to a yield of the process module. The model may initially be an initial model using process tool data from a limited number of test wafers that contain test structures. The model may also be an expanded model using process tool data from product wafers containing embedded test structures in areas with no product devices.

Abstract: An integrated circuit (IC) device fabrication process may be monitored by processing product wafers to fabricate product IC devices, collecting process tool data from tools used to fabricate the product IC devices, and testing the product IC devices. To predict and monitor yield, the process tool data collected during processing and the defectivity data from testing the product IC devices may be input to a yield model that also takes into account design information particular to the product devices. The design information may comprise layout attributes of the product devices. The yield model may be generated from a defectivity model created by processing test wafers to fabricate test structures, collecting process tool data from tools used to fabricate the test structures, and testing the test structures. The test structures may have varying layout attributes to cover a design space allowed by design rules for particular product IC devices.

Abstract: In one example, the present invention is directed to wound-healing patche that passively or actively draw fluids from a wound using an internal, integral vacuum source. The patches may also include electrodes and electronics for electrostimulation, and bioactive compounds that promote healing, such as anti-inflammatory agents.