Patents by Inventor Michael Vainer

Michael Vainer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9713883
    Abstract: The present invention generally relates to polymeric materials pulverization. More particularly, the present invention relates to an extrusion method and device for producing particulate deformed polymers having a more useful resultant devulcanized surface area for downstream industrial usage. Specifically, the present invention relates to a pulverization extrusion method and device that utilizes the herein described specific combination of variable feed screw torque and variable main screw speed together with coupled temperature control of the extruder barrel and extruder main screw.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: July 25, 2017
    Assignee: POLYMERIC POWDERS COMPANY PTY LTD
    Inventor: Michael Vainer
  • Patent number: 9546258
    Abstract: The present invention relates generally to utilizing gasses for fragmenting polymeric materials and simultaneously modifying the surface area molecular structure of the said polymeric materials. More particularly, the present invention relates to a method and associated device for the processing of already preliminarily deformed polymeric materials, preferably without metal reinforcing elements, by utilizing aggressive gasses to both modify the polymeric materials surface area into an activated state and also simultaneously fragment the fed preliminarily deformed polymeric materials into a powder-like form with a relatively increased surface area.
    Type: Grant
    Filed: January 21, 2013
    Date of Patent: January 17, 2017
    Assignee: POLYMERIC POWDERS COMPANY PTY LTD
    Inventor: Michael Vainer
  • Publication number: 20160145408
    Abstract: The present invention relates generally to utilising gasses for fragmenting polymeric materials and simultaneously modifying the surface area molecular structure of the said polymeric materials. More particularly, the present invention relates to a method and associated device for the processing of already preliminarily deformed polymeric materials, preferably without metal reinforcing elements, by utilising aggressive gasses to both modify the polymeric materials surface area into an activated state and also simultaneously fragment the fed preliminarily deformed polymeric materials into a powder-like form with a relatively increased surface area.
    Type: Application
    Filed: January 21, 2013
    Publication date: May 26, 2016
    Inventor: Michael VAINER
  • Patent number: 9258134
    Abstract: A system includes a recording server connected to a private branch exchange (PBX) and/or an interface device, where the connected PBX and/or interface device are each connected to an electronic communication network. The PBX provides at least a first portion of a mobile communication on the electronic communication network to the recording server, and the interface device provides a second portion of the mobile communication to the recording server, wherein the recording server, the PBX, and, if connected to the recording server, the interface device are each assigned to a same organization. A method provides a mobile device and a PBX each registered to an organization, a smart client enforces a policy regarding at least one of incoming mobile communications and outgoing mobile communications on the mobile device, providing a recording server connected to the PBX and simulating an extension of the PBX, conferencing a recording server and recording content.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: February 9, 2016
    Assignee: NICE-SYSTEMS LTD.
    Inventors: Leon Portman, Asaf Shalom, Michael Vainer, Shay Weiss
  • Publication number: 20150328801
    Abstract: The present invention generally relates to polymeric materials pulverisation. More particularly, the present invention relates to an extrusion method and device for producing particulate deformed polymers having a more useful resultant devulcanised surface area for downstream industrial usage. Specifically, the present invention relates to a pulverisation extrusion method and device that utilises the herein described specific combination of variable feed screw torque and variable main screw speed together with coupled temperature control of the extruder barrel and extruder main screw.
    Type: Application
    Filed: January 9, 2013
    Publication date: November 19, 2015
    Applicant: POLYMERIC POWERS COMPANY PTY LTD.
    Inventor: Michael VAINER
  • Patent number: 8573077
    Abstract: A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.
    Type: Grant
    Filed: October 2, 2012
    Date of Patent: November 5, 2013
    Assignee: Camtek Ltd.
    Inventors: Itzik Nisany, Amir Gilead, Michael Vainer, Valery Nuzni
  • Publication number: 20130050468
    Abstract: A method and an inspection system that includes: a multi wafer support device arranged to concurrently support multiple wafers; optics arranged to acquire images of the multiple wafers supported by the multi wafer support element; a mechanical stage arranged to introduce movement between the multi wafer support element and the optics; and a processor arranged to process the images acquired by the optics.
    Type: Application
    Filed: August 1, 2012
    Publication date: February 28, 2013
    Applicant: CAMTEK LTD.
    Inventors: Gilad Golan, Arnon Ben Natan, Omri Katz, Michael Vainer
  • Patent number: 8281674
    Abstract: A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: October 9, 2012
    Assignee: Camtek Ltd.
    Inventors: Itzik Nisany, Amir Gilead, Michael Vainer, Valery Nuzni
  • Patent number: 8225701
    Abstract: The present invention relates to a tire segmenting device capable of cutting tires into two or more segments, the device including: a cutter for dividing the tire into two or more segments; a positioning device on which the tire is mounted, the positioning device positioning a tire mounted thereon in alignment with the cutter; and a moving device operatively connected to the positioning device; wherein in use, the moving device moves the positioning device between a loading position in which a tire can be loaded and unloaded from the positioning device and a cutting position where the cutter engages the tire and divides the tire into the two or more segments.
    Type: Grant
    Filed: November 12, 2007
    Date of Patent: July 24, 2012
    Inventors: Michael Vainer, Boris Rozenblit
  • Publication number: 20120088475
    Abstract: A system includes a recording server connected to a private branch exchange (PBX) and/or an interface device, where the connected PBX and/or interface device are each connected to an electronic communication network. The PBX provides at least a first portion of a mobile communication on the electronic communication network to the recording server, and the interface device provides a second portion of the mobile communication to the recording server, wherein the recording server, the PBX, and, if connected to the recording server, the interface device are each assigned to a same organization. A method provides a mobile device and a PBX each registered to an organization, a smart client enforces a policy regarding at least one of incoming mobile communications and outgoing mobile communications on the mobile device, providing a recording server connected to the PBX and simulating an extension of the PBX, conferencing a recording server and recording content.
    Type: Application
    Filed: October 12, 2010
    Publication date: April 12, 2012
    Inventors: Leon PORTMAN, Asaf Shalom, Michael Vainer, Shay Weiss
  • Publication number: 20120065280
    Abstract: A method and device for processing of polymeric waste which may be associated with elements such as non-polymeric material or metals. In a specific embodiment the method includes the steps of (1) loading preliminarily deformed waste into a reaction chamber, (2) applying an aggressive medium to the waste for a time sufficient to convert the one or more polymers to fragments, and separate one of more polymers from their associated elements, and (3) subjecting the products of step (2) to mechanical separation of the associated elements from the polymer fragments. The method and device is particularly useful for the processing of tires including preliminarily deformed tire segments or shredded tire waste.
    Type: Application
    Filed: May 3, 2010
    Publication date: March 15, 2012
    Applicant: VR TEK PTY LTD
    Inventors: Michael Vainer, Boris Rozenblit
  • Publication number: 20090183583
    Abstract: A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.
    Type: Application
    Filed: August 24, 2006
    Publication date: July 23, 2009
    Inventors: Itzik Nisany, Amir Gilead, Michael Vainer, Valery Nuzni