Patents by Inventor Michael vanAbbema

Michael vanAbbema has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200350217
    Abstract: Preheat processes for a millisecond anneal system are provided. In one example implementation, a preheat process can include receiving a substrate on a wafer support plate in a processing chamber of a millisecond anneal system; obtaining one or more temperature measurements of the wafer support plate using a temperature sensor; and applying a preheat recipe to heat the wafer support plate based at least in part on the temperature of the wafer support plate. In one example implementation, a preheat process can include obtaining one or more temperature measurements from a temperature sensor having a field of view of a wafer support plate in a millisecond anneal system; and applying a pulsed preheat recipe to heat the wafer support plate in the millisecond anneal system based at least in part on the one or more temperature measurements.
    Type: Application
    Filed: July 23, 2020
    Publication date: November 5, 2020
    Inventors: Markus Lieberer, Christian Pfahler, Markus Hagedorn, Michael vanAbbema, Alexandr Cosceev
  • Patent number: 10727140
    Abstract: Preheat processes for a millisecond anneal system are provided. In one example implementation, a preheat process can include receiving a substrate on a wafer support plate in a processing chamber of a millisecond anneal system; obtaining one or more temperature measurements of the wafer support plate using a temperature sensor; and applying a preheat recipe to heat the wafer support plate based at least in part on the temperature of the wafer support plate. In one example implementation, a preheat process can include obtaining one or more temperature measurements from a temperature sensor having a field of view of a wafer support plate in a millisecond anneal system; and applying a pulsed preheat recipe to heat the wafer support plate in the millisecond anneal system based at least in part on the one or more temperature measurements.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: July 28, 2020
    Assignees: MATTSON TECHNOLOGY, INC., BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY CO., LTD.
    Inventors: Markus Lieberer, Christian Pfahler, Markus Hagedorn, Michael vanAbbema, Alexandr Cosceev
  • Publication number: 20170194220
    Abstract: Preheat processes for a millisecond anneal system are provided. In one example implementation, a preheat process can include receiving a substrate on a wafer support plate in a processing chamber of a millisecond anneal system; obtaining one or more temperature measurements of the wafer support plate using a temperature sensor; and applying a preheat recipe to heat the wafer support plate based at least in part on the temperature of the wafer support plate. In one example implementation, a preheat process can include obtaining one or more temperature measurements from a temperature sensor having a field of view of a wafer support plate in a millisecond anneal system; and applying a pulsed preheat recipe to heat the wafer support plate in the millisecond anneal system based at least in part on the one or more temperature measurements.
    Type: Application
    Filed: December 13, 2016
    Publication date: July 6, 2017
    Inventors: Markus Lieberer, Christian Pfahler, Markus Hagedorn, Michael vanAbbema, Alexandr Cosceev