Patents by Inventor Michael Vargas

Michael Vargas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for gold removal from electronic components
    Patent number: 8943662
    Abstract: In some embodiments, a method removes gold plating on an electronic component. The method includes forming a gold and solder mixture on the electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: February 3, 2015
    Assignee: Raytheon Company
    Inventors: Paul B. Hafeli, Eli Holzman, Aaron J. Stein, Michael Vargas
  • TRAILER JACK STAND SUPPORT
    Publication number: 20150028177
    Abstract: The present invention relates to a jack stand and safety support comprising: four sides that substantially form a pyramid; two of said four sides being opposite each other including cut outs and handles; a top including a three tiers basin that includes an optional drainage channel extending across all tiers and drainage holes and glow in the dark lengthwise strips along the corners of said jack stand and support.
    Type: Application
    Filed: July 24, 2014
    Publication date: January 29, 2015
    Inventor: Michael Vargas
  • Method of gold removal from electronic components
    Patent number: 8413320
    Abstract: In some embodiments, a method removes gold plating on an electronic component. The method includes forming a gold and solder mixture on the electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: April 9, 2013
    Assignee: Raytheon Company
    Inventors: Paul B. Hafeli, Eli Holzman, Aaron J. Stein, Michael Vargas
  • GOLD REMOVAL FROM ELECTRONIC COMPONENTS
    Publication number: 20120192406
    Abstract: In some embodiments, a method removes gold plating on an electronic component. The method includes forming a gold and solder mixture on the electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure.
    Type: Application
    Filed: January 28, 2011
    Publication date: August 2, 2012
    Inventors: Paul B. Hafeli, Eli Holzman, Aaron J. Stein, Michael Vargas