Abstract: A method and apparatus for a thermally conductive packaging technique for cooling electronic systems. A heat source is partially surrounded by a set of thermal transfer media. A set of thermal transfer shells partially surround the set of thermal transfer media. The heat source connection means are left exposed and utilized for connection to the electronic system. The heat source, the set of thermal transfer media configured to partially surround the heat source, and the thermal transfer shell partially surrounding the set of thermal transfer media form a thermal transfer module. Thermal transfer modules may be placed in thermally conductive cells. A set of thermal transfer sheets are placed in contact with both or either of the thermal transfer module and the thermally conductive cell, facilitating a heat exchange with an environment external to the thermal transfer module.

Abstract: An EMI shielding gasket for reducing the amount of force required during the mounting process. The present invention provides an extended lip feature on the gasket to facilitate the installation process and to function as a lead-in, such that less force is required by the assembler when mounting the EMI gasket. As less manipulation may be required to install the gaskets, gaskets may be mounted correctly more often, thereby preventing the occurrence of EMI leakage. The present invention also reduces the possibility that the EMI gaskets may become damaged due to excess manipulation, and assemblers may experience fewer physical problems related to manipulating the gaskets. By reducing the amount of force required to mount the EMI gaskets, the present invention may increase productivity by decreasing assembly time, decrease rework of improperly assembled or damaged gaskets, and reduce health risks and subsequent insurance claims of assemblers during manufacturing.

Abstract: A disk drive system includes a disk drive array enclosure forming receiving cavities for housing respective disk drive modules. Each receiving cavity is defined by top, bottom, and rear surfaces, and an opening. The top and bottom surfaces of each receiving cavity expand away from one another to form receiving slots adjacent the opening of the receiving cavity. The disk drive system further includes a disk drive module having a housing and a disk drive carrier handle connected to the housing. The drive module is insertable into a receiving cavity of the drive array enclosure such that the housing is enclosed by the top, bottom, and rear surfaces of the receiving cavity and the drive carrier handle is positioned at the opening of the receiving cavity. The drive carrier handle has tab purchases located around the periphery of the drive carrier handle.

Abstract: The frameless, stackable cabinet system for use with rack mounted electronic equipment comprises stackable wall members that mechanically interconnect without the need for tools to assemble the cabinet. A base unit and cover unit provide the interlocking top and bottom members of the cabinet. The stackable wall members come in various heights and can be interlocked together and to both the base unit and cover unit to configure a cabinet of desired height. Each stackable wall member therefore not only provides a mounting site for a rack mounted piece of electronic equipment, but also serves to provide the wiring channels through openings formed in the stackable wall members. The cabinet system can be transported in a disassembled form to reduce shipping costs and can be simply assembled on site via the interlocking interconnection of the stackable wall members. The resultant cabinet can be reconfigured without a significant effort and the certification of the resultant cabinet configuration can be simplified.