Abstract: Apparatuses for controlling fluid flow are important components for delivering process fluids for semiconductor fabrication. These apparatuses for controlling fluid flow are formed with a variety of fluid flow components, including fluid flow components for mixing fluid flows. Fluid flow components for mixing flows utilize mixing elements configured to receive flows of two or more process fluid flows via fluid inlets, mix the fluid flow within the mixing element, and deliver mixed fluid to a down-stream fluid flow component or an outlet of an apparatus for controlling fluid flow.

Abstract: A vacuum assembly for removing debris formed on the surface of a work chuck after a wafer grinding process by positioning a vacuum source above the work chuck and then activating the vacuum source.

Abstract: A scraper assembly for removing debris deposited on the surface of a porous work chuck during a wafer grinding process.

Abstract: A vacuum assembly for removing debris formed on the surface of a work chuck after a wafer grinding process by positioning a vacuum source above the work chuck and then activating the vacuum source.

Abstract: A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving the inner coarse wheel down relative to the stationary outer fine wheel.

Abstract: A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving the inner coarse wheel down relative to the stationary outer fine wheel.

Abstract: A cleaning device for use in a semiconductor processing. The device comprises a substrate supporter for supporting a substrate to be cleaned, a scrub pad mounting plate, and a chuck coupling to the substrate supporter and the scrub pad mounting plate. The chuck is configured to move the substrate supporter and the scrub pad mounting plate. The device further comprises a scrub pad mountable to and moveable from the scrub pad mounting plate. The scrub pad, when mounted to the scrub pad mounting plate, is higher than the substrate when mounted on the substrate supporter. The scrub pad mounting plate and the substrate supporter can both be coupled to the chuck so that the chuck moves both the scrub pad mounting plate and the substrate supporter in one action.

Abstract: A cleaning device for use in a semiconductor processing. The device comprises a substrate supporter for supporting a substrate to be cleaned, a scrub pad mounting plate, and a chuck coupling to the substrate supporter and the scrub pad mounting plate. The chuck is configured to move the substrate supporter and the scrub pad mounting plate. The device further comprises a scrub pad mountable to and moveable from the scrub pad mounting plate. The scrub pad, when mounted to the scrub pad mounting plate, is higher than the substrate when mounted on the substrate supporter. The scrub pad mounting plate and the substrate supporter can both be coupled to the chuck so that the chuck moves both the scrub pad mounting plate and the substrate supporter in one action.

Abstract: The present invention provides exemplary methods, systems and apparatus that provide improved substrate characteristics after grinding operations by avoiding or reducing overgrind damage to the wafers. In one embodiment, a grinding apparatus (100) includes a first spindle (110) having an eccentric-shaped abrasive matrix (112) coupled thereto and a second spindle (116) adapted to hold a substrate (118) to be ground. The second spindle is offset from said first spindle such that the abrasive matrix passes through the substrate surface center (134) for only a portion of the time during grinding operations.

Abstract: A method and apparatus for conditioning a polishing pad are described. The method includes steps of providing a chemical mechanical polishing apparatus having a polishing region and a conditioning region; cycling a polishing member through the apparatus; contacting the polishing member in the conditioning region with a conditioning member; and conditioning the polishing member. The apparatus includes an end effector adapted to receive a conditioning member, the end effector being attached to an arm that can be moved horizontally and vertically, and a strain gauge that monitors the force applied to a polishing member.

Abstract: The present invention provides exemplary methods, systems and apparatus that provide improved substrate characteristics after grinding operations by avoiding or reducing overgrind damage to the wafers. In one embodiment, a grinding apparatus (100) includes a first spindle (110) having an eccentric-shaped abrasive matrix (112) coupled thereto and a second spindle (116) adapted to hold a substrate (118) to be ground. The second spindle is offset from said first spindle such that the abrasive matrix passes through the substrate surface center (134) for only a portion of the time during grinding operations.