Abstract: A connector includes an electromagnetic shield formed of conductive material with at least two depending, conductive, reinforcement sidewalls that each have a plurality of conductive depending sidewall legs distributed about a periphery of the shield and extending upwardly. The shield includes at least one conductive ground tab extending from an edge such that the shield provides a ground path directly from a circuit board to a connector housing. The shield defines at least one opening for receiving an alignment post and at least one additional rectangular opening to permit access to an electrical terminal positioned below the sheet. The rectangular opening may be aligned with terminals positioned within connector housing.

Abstract: An electromagnetic shield for an electrical connector comprises a sheet formed of conductive material and has a top side with at least two depending, conductive, reinforcement sidewalls that each have a plurality of conductive depending sidewall legs distributed about a periphery of the sheet and extending upwardly. The shield includes at least one conductive ground tab extending from an edge such that the shield provides a ground path directly from a circuit board to a connector housing. The shield defines at least one opening for receiving an alignment post and at least one additional opening to permit access to an electrical terminal positioned below the sheet. The openings may be rectangular in shape and aligned with terminals positioned within connector housing.

Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics.

Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics.

Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics.