Patents by Inventor Michael W. Barror
Michael W. Barror has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11103714Abstract: Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.Type: GrantFiled: May 7, 2019Date of Patent: August 31, 2021Assignee: Medtronic, Inc.Inventors: Michael W. Barror, John K. Day, David A. Ruben, James D. Bradley
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Publication number: 20190255335Abstract: Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.Type: ApplicationFiled: May 7, 2019Publication date: August 22, 2019Inventors: Michael W. Barror, John K. Day, David A. Ruben, James D. Bradley
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Patent number: 10123882Abstract: A spinal implant includes an implant body including a first endplate and a second endplate. A plurality of electrodes include at least one electrode disposed with the first endplate and at least one electrode disposed with the second endplate such that the electrodes conduct an electric current to stimulate tissue growth adjacent the implant body. Systems, surgical instruments and methods are disclosed.Type: GrantFiled: July 6, 2015Date of Patent: November 13, 2018Assignee: Warsaw Orthopedic, Inc.Inventors: Tyler S. Stevenson, Nicholas M. Benson, Richard L. Brown, Calvert S. Bontemps, Newton H. Metcalf, Larry Tyler, Kevin T. Foley, Mark E. Henschel, Michael W. Barror
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Publication number: 20170100597Abstract: Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.Type: ApplicationFiled: June 29, 2016Publication date: April 13, 2017Inventors: Michael W. Barror, John K. Day, David A. Ruben, James D. Bradley
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Publication number: 20170007420Abstract: A spinal implant includes an implant body including a first endplate and a second endplate. A plurality of electrodes include at least one electrode disposed with the first endplate and at least one electrode disposed with the second endplate such that the electrodes conduct an electric current to stimulate tissue growth adjacent the implant body. Systems, surgical instruments and methods are disclosed.Type: ApplicationFiled: July 6, 2015Publication date: January 12, 2017Inventors: Tyler S. Stevenson, Nicholas M. Benson, Richard L. Brown, Calvert S. Bontemps, Newton H. Metcalf, Larry Tyler, Kevin T. Foley, Mark E. Henschel, Michael W. Barror
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Patent number: 9450267Abstract: A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.Type: GrantFiled: February 13, 2015Date of Patent: September 20, 2016Assignees: MEDTRONIC, INC., SAPURAST RESEARCH LLCInventors: John K. Day, Michael W. Barror, Shawn W. Snyder, Alexandra Z. LaGuardia, Damon E. Lytle, Bernd J. Neudecker
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Publication number: 20150155590Abstract: A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.Type: ApplicationFiled: February 13, 2015Publication date: June 4, 2015Inventors: John K. Day, Michael W. Barror, Shawn W. Snyder, Alexandra Z. LaGuardia, Damon E. Lytle, Bernd J. Neudecker
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Patent number: 8956712Abstract: A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.Type: GrantFiled: December 3, 2012Date of Patent: February 17, 2015Assignees: Medtronic, Inc., Sapurast Research LLCInventors: Michael W. Barror, John K. Day, Shawn W. Snyder, Alexandra Z. LaGuardia, Damon E. Lytle, Bernd J. Neudecker
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Patent number: 8903497Abstract: System and method for making an antenna. An implantable medical device has a housing, a bobbin and a coil. The housing has an interior generally tubular cross-section with a longitudinal axis, the housing having a lateral portion of a segment of the tubular cross-section along the longitudinal axis. The bobbin has a first side nearest to the interior of the housing and a second side opposite the first side. The coil, wound around the bobbin on a winding axis orthogonal to the longitudinal axis of the tubular cross-section, has a greater number of complete turns proximate the second side of the bobbin than proximate the first side of the bobbin, with the coil having a cross-sectional shape selected for a space between the bobbin and the interior of the housing in the lateral portion of the segment of the tubular cross-section along the longitudinal axis of the housing.Type: GrantFiled: September 30, 2010Date of Patent: December 2, 2014Assignee: Medtronic, Inc.Inventors: Clark B. Norgaard, Michael W. Barror, Douglas D. Nippoldt, Tony A. Ulrich
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Publication number: 20140154553Abstract: A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.Type: ApplicationFiled: December 3, 2012Publication date: June 5, 2014Applicants: Infinite Power Solutions, Inc., Medtronic, Inc.Inventors: John K. Day, Michael W. Barror, Shawn W. Snyder, Alexandra Z. LaGuardia, Damon E. Lytle, Bernd J. Neudecker
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Publication number: 20120108993Abstract: An improved design for subcutaneous monitors that addresses the problem caused by bubbles of air may remain in the pocket in which the device is implanted. As implantable monitors and their associated electrodes are reduced in size, these bubbles may in some cases cover one or both electrodes, interfering with sensing of the ECG signal. The invention addresses this problem by configuring the electrodes to increase the pressure of the electrodes against the tissue above the electrodes relative to the pressures exerted by the adjacent outer facing surfaces of the device.Type: ApplicationFiled: October 26, 2011Publication date: May 3, 2012Applicant: Medtronic, Inc.Inventors: Charles R. Gordon, Brian B. Lee, Michael W. Barror
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Publication number: 20120081201Abstract: System and method for making an antenna. An implantable medical device has a housing, a bobbin and a coil. The housing has an interior generally tubular cross-section with a longitudinal axis, the housing having a lateral portion of a segment of the tubular cross-section along the longitudinal axis. The bobbin has a first side nearest to the interior of the housing and a second side opposite the first side. The coil, wound around the bobbin on a winding axis orthogonal to the longitudinal axis of the tubular cross-section, has a greater number of complete turns proximate the second side of the bobbin than proximate the first side of the bobbin, with the coil having a cross-sectional shape selected for a space between the bobbin and the interior of the housing in the lateral portion of the segment of the tubular cross-section along the longitudinal axis of the housing.Type: ApplicationFiled: September 30, 2010Publication date: April 5, 2012Inventors: Clark B. Norgaard, Michael W. Barror, Douglas D. Nippoldt, Tony A. Ulrich
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Patent number: 6765396Abstract: A method, device and software are disclosed which permit testing of both the optical portion and the electrical portion of an imaging device in a live bug configuration. Once an automated handler has positioned the device to be tested, the optical sensor on the image device is illuminated with electromagnetic radiation and electrical test signals are provided through the electrical pins on the integrated circuit package. These electrical and optical tests can be performed in sequence or simultaneously. The automated handler does not need to reposition or disengage from the device under test until both the electrical and optical tests are completed.Type: GrantFiled: April 4, 2002Date of Patent: July 20, 2004Assignee: Freescale Semiconductor, Inc.Inventor: Michael W. Barror
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Publication number: 20030189440Abstract: A method, device and software are disclosed which permit testing of both the optical portion and the electrical portion of an imaging device in a live bug configuration. Once an automated handler has positioned the device to be tested, the optical sensor on the image device is illuminated with electromagnetic radiation and electrical test signals are provided through the electrical pins on the integrated circuit package. These electrical and optical tests can be performed in sequence or simultaneously. The automated handler does not need to reposition or disengage from the device under test until both the electrical and optical tests are completed.Type: ApplicationFiled: April 4, 2002Publication date: October 9, 2003Inventor: Michael W. Barror