Patents by Inventor Michael W. Beckman

Michael W. Beckman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connecting a component with an embedded optical fiber
    Patent number: 7373068
    Abstract: The invention provides an optical connection between a component on a printed circuit board (“PUB”) and an optical fiber embedded in the PCB. By optically connecting the component with the optical fiber, the component may use the optical fiber for high speed optical data communication.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: May 13, 2008
    Assignee: Intel Corporation
    Inventors: Jayne L. Mershon, William O. Alger, Gary A. Brist, Gary B. Long, Michael W. Beckman
  • Apparatus and method for an embedded air dielectric for a package and a printed circuit board
    Patent number: 7361842
    Abstract: A method, apparatus, and system for a printed circuit board (PCB) and package with an embedded air dielectric includes a conductor formed on a surface of a first core layer, a conductor layer overlaying an inner surface of a cavity formed in a second core layer, the conductor layer opposing the conductor, and a sealed air channel between and separating the conductor and the conductor layer from contacting each other. A gas in the sealed air channel provides a primary dielectric therein. The gas may be air.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: April 22, 2008
    Assignee: Intel Corporation
    Inventors: Gary A. Brist, William O. Alger, Gary B. Long, Jayne L. Mershon, Michael W. Beckman
  • Electrical socket with compressible domed contacts
    Patent number: 7234947
    Abstract: A compressible domed contact used as a portion of socket contact within an electrical socket to eliminate co-planarity issues and to achieve an effective electrical connection between the electrical socket and a microelectronic device. The compressible domed contact may be made of resilient material such that it will substantially return to its original shape after being compressed.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: June 26, 2007
    Assignee: Intel Corporation
    Inventors: William O. Alger, Gary B. Long, Gary A. Brist, Jayne L. Mershon, Michael W. Beckman
  • Electrical socket with compressible domed contacts
    Patent number: 7121841
    Abstract: A compressible domed contact used as a portion of socket contact within an electrical socket to eliminate co-planarity issues and to achieve an effective electrical connection between the electrical socket and a microelectronic device. The compressible domed contact may be made of resilient material such that it will substantially return to its original shape after being compressed.
    Type: Grant
    Filed: November 10, 2004
    Date of Patent: October 17, 2006
    Assignee: Intel Corporation
    Inventors: William O. Alger, Gary B. Long, Gary A. Brist, Jayne L. Mershon, Michael W. Beckman