Patents by Inventor Michael W. Blum

Michael W. Blum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230275604
    Abstract: A transceiver having a down-converter for converting a radio-frequency (RF) input signal to an intermediate frequency (IF) signal with an analog low latency bypass path coupled to the IF signal and configured to provide a low latency IF signal and an up-converter for converting an IF signal to an RF signal. There is a digital path coupled to the IF signal and configured to provide a digitally processed IF signal, and an up-converter for converting at least one of the low latency IF signal and the digitally processed IF signal to an RF output signal. In a further example, the down-converter and the up-converter convert to millimeter wave frequencies and filters the millimeter wave frequencies with cavity filters.
    Type: Application
    Filed: May 1, 2023
    Publication date: August 31, 2023
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Dean Puzzo, Michael W. Blum, Christopher R. Bye
  • Patent number: 11664832
    Abstract: A transceiver having a transceiver including a down-converter for converting a radio-frequency (RF) input signal to an intermediate frequency (IF) signal with an analog low latency bypass path coupled to the IF signal and configured to provide a low latency IF signal. There is a digital path coupled to the IF signal and configured to provide a digitally processed IF signal, and an up-converter for converting at least one of the low latency IF signal and the digitally processed IF signal to an RF output signal. In a further example, the down-converter and the up-converter convert to millimeter wave frequencies and filters the millimeter wave frequencies with cavity filters comprising quartz.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: May 30, 2023
    Assignee: Bae Systems Information and Electronic Systems Integration Inc.
    Inventors: Dean Puzzo, Michael W. Blum, Christopher R. Bye
  • Patent number: 5302024
    Abstract: A monolithic integrated circuit power sensor provides a monolithic integrated circuit substrate, a conversion element formed either on or in the substrate for converting microwave energy into heat, and a thermally sensitive diode junction formed in sufficiently close proximity to the conversion element to be thermally coupled thereto.
    Type: Grant
    Filed: February 26, 1993
    Date of Patent: April 12, 1994
    Assignee: Lockheed Sanders, Inc.
    Inventor: Michael W. Blum