Patents by Inventor Michael W Cumbie, Jr.

Michael W Cumbie, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inverted TIJ
    Patent number: 10780698
    Abstract: A fluid ejection die includes a substrate including an array of nozzles.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: September 22, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, Jr., Chien-Hua Chen, Erik D. Torniainen