Patents by Inventor Michael W. Davis

Michael W. Davis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12216013
    Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.
    Type: Grant
    Filed: November 9, 2023
    Date of Patent: February 4, 2025
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Peter F. Ladwig, Matthew S. Lang, Dean E. Myers, Clark T. Olsen, Douglas P. Riemer
  • Patent number: 12159983
    Abstract: A battery pouch is described. The battery pouch including an outer layer and an inner layer disposed on the outer layer. The inner layer including at least one sensor.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: December 3, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Douglas P. Riemer, Michael W. Davis, Peter F. Ladwig
  • Patent number: 12049877
    Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: July 30, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Mark A. Miller, Nathaniel K. Behning, Dean E. Myers, Michael W. Davis, Ryan N. Ruzicka
  • Publication number: 20240077782
    Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 7, 2024
    Inventors: Mark A. Miller, Nathaniel K. Behning, Dean E. Myers, Michael W. Davis
  • Publication number: 20240068889
    Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Inventors: Michael W. Davis, Peter F. Ladwig, Matthew S. Lang, Dean E. Myers, Clark T. Olsen, Douglas P. Riemer
  • Patent number: 11907790
    Abstract: An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: February 20, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Dean E. Myers, Michael W. Davis, Clark T. Olsen, Beauregard J. Gagnon
  • Patent number: 11867160
    Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: January 9, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Mark A. Miller, Nathaniel K. Behning, Dean E. Myers, Michael W. Davis
  • Patent number: 11867575
    Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: January 9, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Peter F. Ladwig, Matthew S. Lang, Dean E. Myers, Clark T. Olsen, Douglas P. Riemer
  • Patent number: 11791521
    Abstract: Electric tabs and methods for manufacturing are described. A method includes disposing a dielectric layer on a second side of a base material, the base material having a first side and the second side. The method including developing the dielectric layer on the second side of the base material. And, the method including etching the first side of the base material to form an electrode tab.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: October 17, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Douglas P. Riemer, Peter F. Ladwig, Joseph D. Starkey, Michael W. Davis, Duane M. Jelkin
  • Patent number: 11782286
    Abstract: Embodiments of the disclosure include a suspension assembly having a support member, a moving member movably coupled to the support member, and shape metal alloy wires coupled between the support and moving members by attachment structures. In embodiments, the attachment structures include a first portion and a second portion configured to be crimped together. In embodiments, at least one of the first and second portions include an etched recess.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: October 10, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Peter F. Ladwig, Mark A. Miller, Michael W. Davis, Bryan J. Scheele, Douglas P. Riemer, Donald M. Anderson, John A. Theget
  • Patent number: 11769977
    Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: September 26, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
  • Patent number: 11686294
    Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: June 27, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Mark A. Miller, Nathaniel K. Behning, Dean E. Myers, Michael W. Davis, Ryan N. Ruzicka, Zachary A. Pokornowski, Yasushi Sakamoto
  • Patent number: 11682876
    Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: June 20, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
  • Patent number: 11638353
    Abstract: An apparatus is described. The apparatus includes a substrate and one or more sensor components formed on the substrate. And, the apparatus includes one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: April 25, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Jeffery G. Ribar, Clark T. Olsen
  • Patent number: 11448853
    Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: September 20, 2022
    Assignee: Hutchinson Technology Incorporated
    Inventors: Mark A. Miller, Nathaniel K. Behning, Dean E. Myers, Michael W. Davis, Ryan N. Ruzicka
  • Publication number: 20220252055
    Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
    Type: Application
    Filed: April 26, 2022
    Publication date: August 11, 2022
    Inventors: Mark A. Miller, Nathaniel K. Behning, Dean E. Myers, Michael W. Davis, Ryan N. Ruzicka, Zachary A. Pokornowski, Yasushi Sakamoto
  • Patent number: 11409070
    Abstract: Embodiments of the disclosure include a suspension assembly having a support member, a moving member movably coupled to the support member, and shape metal alloy wires coupled between the support and moving members by attachment structures. According to various embodiments, the attachment structures include at least one of: an adhesive disposed proximate to a side of the attachment structures and between the attachment structures.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: August 9, 2022
    Assignee: Hutchinson Technology Incorporated
    Inventors: Bryan J. Scheele, Dean E. Myers, Michael W. Davis, Erich W. Bierbrauer, Mark A. Miller
  • Publication number: 20220196494
    Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.
    Type: Application
    Filed: January 28, 2022
    Publication date: June 23, 2022
    Inventors: Michael W. Davis, Peter F. Ladwig, Matthew S. Lang, Dean E. Myers, Clark T. Olsen, Douglas P. Riemer
  • Patent number: 11333134
    Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: May 17, 2022
    Assignee: Hutchinson Technology Incorporated
    Inventors: Mark A. Miller, Nathaniel K. Behning, Dean E. Myers, Michael W. Davis, Ryan N. Ruzicka, Zachary A. Pokornowski, Yasushi Sakamoto
  • Patent number: 11322806
    Abstract: An electrode tab is described. The electrode tab including a base layer and an outer layer disposed on the base layer. The base layer including a sensor.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: May 3, 2022
    Assignee: Hutchinson Technology Incorporated
    Inventors: Douglas P. Riemer, Michael W. Davis, Peter F. Ladwig