Patents by Inventor Michael W. Dove

Michael W. Dove has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ostomy faceplate having moldable adhesive wafer with diminishing surface undulations
    Patent number: 8211073
    Abstract: An ostomy faceplate and its method of application are disclosed in which the faceplate comprises an annular adhesive wafer of soft, moisture-absorbent, memory-free, essentially non-elastic and finger-moldable adhesive skin barrier material, the wafer's distal surface having an outer zone terminating at the outer periphery of the wafer and an inner zone extending inwardly from the inner limits of the outer zone to a stoma-receiving opening at the inner periphery of the wafer. The faceplate also includes a flexible backing layer covering the outer zone and a removable cover member having a smooth surface releasably covering the proximal bodyside surface of the wafer.
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: July 3, 2012
    Assignee: Hollister Incorporated
    Inventors: Michael W. Dove, Jeffrey E. Block
  • OSTOMY FACEPLATE HAVING MOLDABLE ADHESIVE WAFER WITH DIMINISHING SURFACE UNDULATIONS
    Publication number: 20100324511
    Abstract: An ostomy faceplate and its method of application are disclosed in which the faceplate comprises an annular adhesive wafer of soft, moisture-absorbent, memory-free, essentially non-elastic and finger-moldable adhesive skin barrier material, the wafer's distal surface having an outer zone terminating at the outer periphery of the wafer and an inner zone extending inwardly from the inner limits of the outer zone to a stoma-receiving opening at the inner periphery of the wafer. The faceplate also includes a flexible backing layer covering the outer zone and a removable cover member having a smooth surface releasably covering the proximal bodyside surface of the wafer.
    Type: Application
    Filed: October 7, 2009
    Publication date: December 23, 2010
    Applicant: HOLLISTER INCORPORATED
    Inventors: Michael W. Dove, Jeffrey E. Block