Patents by Inventor Michael W. Eisele

Michael W. Eisele has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shunt voltage regulator and method of using
    Patent number: 7281866
    Abstract: A shunt voltage regulator for a processor is disposed on the processor package. The shunt voltage regulator responds to AC transients. One embodiment includes a DC power converter voltage regulator that is disposed off the processor package, and that is optimized for DC power conversion. Another embodiment includes a method of improving fabrication yield for a packaged processor.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: October 16, 2007
    Assignee: Intel Corporation
    Inventors: Michael T. Zhang, Michael W. Eisele, Robert T. Carroll, William B. Pohlman, Kenneth A. Ostrom
  • Shunt voltage regulator and method of using
    Publication number: 20040245965
    Abstract: A shunt voltage regulator for a processor is disposed on the processor package. The shunt voltage regulator responds to AC transients. One embodiment includes a DC power converter voltage regulator that is disposed off the processor package, and that is optimized for DC power conversion. Another embodiment includes a method of improving fabrication yield for a packaged processor.
    Type: Application
    Filed: December 30, 2003
    Publication date: December 9, 2004
    Inventors: Michael T. Zhang, Michael W. Eisele, Robert T. Carroll, William B. Pohlman, Kenneth A. Ostrom
  • Shunt transient voltage regulator in a processor package, method of making same, and method of using same
    Patent number: 6632031
    Abstract: A shunt voltage regulator for a processor is disposed on the processor package. The shunt voltage regulator responds to AC transients. One embodiment includes a DC power converter voltage regulator that is disposed off the processor package, and that is optimized for DC power conversion. Another embodiment includes a method of improving fabrication yield for a packaged processor.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: October 14, 2003
    Assignees: Intel Corporation, Primarion, Inc.
    Inventors: Michael T. Zhang, Michael W. Eisele, Robert T. Carroll, William B. Pohlman, Kenneth A. Ostrom