Abstract: A surrogate patch assembly for a rework area of a structure comprises a surrogate patch body which may be formed of a material for drawing moisture from the rework area. The patch assembly may include a sensor mounted to the surrogate patch body. The sensor may comprise a thermal sensor for sensing the temperature of the rework area and the surrogate patch body. The sensor may comprise a moisture sensor for sensing moisture drawn into the surrogate patch body.

Abstract: An installation tool and method are provided to apply a patch to a structure while controlling the porosity in the bond line. An installation tool is provided that includes a frame defining an internal cavity. The installation tool also includes a flexible membrane that divides the internal cavity into a first chamber proximate the surface and a second chamber separated from the surface by the first chamber and the flexible membrane. The flexible membrane is releasably attached to the patch such that the patch faces the surface. The frame includes first and second vacuum ports into the first and second chambers, respectively, such that pressure therewithin is separately controllable. The pressure within the first and second chambers is controlled such that the adhesive is degassed while the patch remains spaced from the surface and the flexible membrane is thereafter caused to be stretched to urge the patch toward the surface.

Abstract: An installation assembly and an associated method for forming a bonded join are provided to permit the adhesive attachment of a first workpiece, such as a patch, to a portion of a second workpiece. The installation assembly and the associated method provide for at least partial debulking of the adhesive prior to curing of the adhesive such that the resulting bondline may have improved mechanical properties as a result of having fewer voids and/or porosity. The installation assembly may include an installation stand and a carrier plate supported by the installation stand and including an attachment surface configured to carry the first workpiece. The installation stand also includes an adjustment mechanism for positioning a carrier plate to a first predefined position to define a gap between the first and second workpieces and also to a second predefined position such that a predetermined bondline thickness is defined between the first and second workpieces.

Abstract: Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.

Abstract: The present disclosure is generally directed to a primer saturated carrier medium assembly including a carrier medium having a front face and an opposing rear face, a primer saturating the carrier medium between the front face and the opposing rear face, and removable film impenetrable to the primer covering opposite faces of the carrier medium. A method of applying primer to a surface includes applying a face of a primer saturated carrier medium to contact a surface, and curing the primer saturated carrier medium on the surface. A structure includes a primer saturated medium including a carrier medium having a front face and an opposing rear face, and a primer saturating the carrier medium between the front face and the opposing rear face. The structure further includes a surface adhered to the primer on one face of the primer saturated medium.

Abstract: An apparatus for fabricating a stack of adhesive plies for attaching a doubler to a surface on a structure includes a digital scanner, configured for scanning the surface and for producing a first set of digital data representing a contour of the surface, and a computer, coupled to the digital scanner, having a processor and system memory. The computer is programmed for mapping a gap between a bonding surface on the doubler and the surface on the structure using the first set of digital data and a second set of digital data representing the bonding surface, and for segmenting the mapped gap into layers corresponding to the adhesive plies.

Abstract: Disclosed are systems and methods of creating altered adhesive bonded joints between metal or composite substrates, including bonds that are weaker in strength than selected reference bonds. One method of creating an altered adhesive bond includes providing a first substrate and a second substrate, selecting a manufacturing process having a plurality of steps designed to produce a desired, or reference, adhesive bond having a desired strength, and selectively altering at least one of the plurality of steps during performance of the manufacturing process to produce an altered bond between the first substrate and the second substrate, the altered bond having an altered strength that is weaker than the strength of the desired adhesive bond. The systems may include systems that may be utilized to create the altered adhesive bonds and/or test standards.

Abstract: An in-situ double vacuum debulk (DVD) composite repair system designed to produce partially or fully cured autoclave-quality hot-bond composite repairs on contoured structures. The system provides vacuum pressure for hot bond repairs to be performed on flat and contoured structures using one set-up capable of debulking (partially curing) and then fully curing composite repairs on composite and metallic aircraft structures. The use of in-situ DVD also eliminates handling of the patch/adhesive when transferring from an off-aircraft DVD chamber to the repair site on the aircraft. This can increase the probability of successful repairs because the possibility of contaminating and misaligning the adhesive and repair patch are eliminated.

Abstract: A method and apparatus are used to fit a metallic or composite doubler on an uneven surface. A three dimensional digital map of the gap between the doubler and the uneven surface is generated by digitally scanning the uneven surface. The digital map is then used to fabricate a stack of adhesive plies tailored to substantially fill the gap between the doubler and the uneven surface.

Abstract: A patch is used to rework an area of a structure. The patch is bonded to the structure by a layer of adhesive. A spacer placed between the patch and the structure is used to control the thickness of the adhesive and/or a bondline.

Abstract: An in-situ double vacuum debulk (DVD) composite repair system designed to produce partially or fully cured autoclave-quality hot-bond composite repairs on contoured structures. The system provides vacuum pressure for hot bond repairs to be performed on flat and contoured structures using one set-up capable of debulking (partially curing) and then fully curing composite repairs on composite and metallic aircraft structures. The use of in-situ DVD also eliminates handling of the patch/adhesive when transferring from an off-aircraft DVD chamber to the repair site on the aircraft. This can increase the probability of successful repairs because the possibility of contaminating and misaligning the adhesive and repair patch are eliminated.

Abstract: A patch may be used to rework a composite structure in the field. The patch is bonded to the structure by a layer of adhesive and includes perforations that allow the escape of air from the adhesive as the patch is compressed against the structure. A spacer may be introduced between the patch and the structure to control the thickness of the adhesive layer.

Abstract: The present disclosure describes one or more systems, methods, routines and/or techniques for thermal management. One or more systems, methods, routines and/or techniques may provide advice or guidance (e.g., to a repair technician) regarding how to perform a hot bond repair, for example, on an aircraft component that has been damaged. The thermal management advisor may provide advice or guidance regarding how to prepare a repair field prior to running a thermal survey. For example, thermal management advisor may recommend a particular heat blanket, a configuration of the heat blanket, placement of various temperature sensors and other preparation guidance. The thermal management advisor may provide advice or guidance regarding how to alter or manage the repair setup during a thermal survey and during the actual curing process. For example, thermal management advisor may recommend particular temperature sensors or areas of the repair field that should be insulated.

Abstract: A method and apparatus for bonding parts. An adhesive and a plurality of beads may be applied onto a first surface of a first part to form a layer of adhesive and beads. The first surface of the first part with the layer of adhesive and beads may be placed in contact with a second surface of a second part to form a structure, wherein the structure may be cured.

Abstract: A surrogate patch assembly for a rework area of a structure comprises a surrogate patch body which may be formed of a material for drawing moisture from the rework area. The patch assembly may include a sensor mounted to the surrogate patch body. The sensor may comprise a thermal sensor for sensing the temperature of the rework area and the surrogate patch body. The sensor may comprise a moisture sensor for sensing moisture drawn into the surrogate patch body.

Abstract: A surrogate patch assembly for a rework area of a structure comprises a surrogate patch body which may be formed of a material for drawing moisture from the rework area. The patch assembly may include a sensor mounted to the surrogate patch body. The sensor may comprise a thermal sensor for sensing the temperature of the rework area and the surrogate patch body. The sensor may comprise a moisture sensor for sensing moisture drawn into the surrogate patch body.

Abstract: A non-conductive composite doubler is fabricated for application to an electrically conductive surface of a structure by: forming the composite doubler; placing an array of capacitive gap thickness sensors between the doubler and the structure surface; measuring the gap thickness between the doubler and the structure surface in a plurality of areas over the surface of the structure; using the gap thickness measurements to shape a layer of adhesive to essentially match the contour of the structure surface; and, applying the layer of adhesive to the doubler.

Abstract: Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.

Abstract: Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.

Abstract: Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.