Patents by Inventor Michael W. Heinks

Michael W. Heinks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040088018
    Abstract: A cardiac pacing device and method for automatically selecting an optimal evoked response sensing vector based on an evaluation of the evoked response signal quality are provided. Electrode switching circuitry allows selection of multiple sensing electrode vectors. Capture detection circuitry provides capture and loss of capture signal characteristics determined during a pacing threshold search to be used in determining evoked response signal quality parameters. An optimal evoked response sensing vector is selected based on evoked response signal quality parameters meeting predetermined criteria for reliable evoked response sensing.
    Type: Application
    Filed: October 31, 2002
    Publication date: May 6, 2004
    Inventors: Robert T. Sawchuk, Michael W. Heinks, David W. Graden
  • Publication number: 20040064059
    Abstract: A system and method for acquiring and processing an EGM signal during a pacing event, wherein a unique converter code is generated upon digitizing of the EGM signal and encrypted in the EGM signal to demarcate a transient event. The system further provides dynamic filtering of the EGM signal and subsequent detection of an intrinsic event signal during the pacing event, from which rhythm events may be diagnosed and classified.
    Type: Application
    Filed: September 30, 2002
    Publication date: April 1, 2004
    Inventors: Kent Samuelson, Michael T. Hemming, Michael W. Heinks, Ross O. Starkson, Lori Durose-Schrimpf, John D. Wahlstrand
  • Patent number: 5140496
    Abstract: A decoupling apparatus for a microcircuit provides for a custom capacitor to be placed directly on the passivated upper surface of the integrated circuit or alternatively to be placed directly under the integrated circuit.In another alternative, multiple standard chip capacitors are placed directly on the passivated upper surface and connected by wire bonds to metal bars also resting on the upper surface.
    Type: Grant
    Filed: January 2, 1991
    Date of Patent: August 18, 1992
    Assignee: Honeywell, Inc.
    Inventors: Michael W. Heinks, Thomas J. Dunaway, Richard Spielberger