Patents by Inventor Michael W. Patterson

Michael W. Patterson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080009334
    Abstract: In accordance with at least one embodiment, a gaming system is operable to determine a first gaming device being operated by a player and select a second gaming device to be controlled, via the first gaming device, by the player. In some embodiments, the gaming system is further operable to configure the second gaming device to be controlled via an interface of the first gaming device.
    Type: Application
    Filed: July 6, 2006
    Publication date: January 10, 2008
    Inventors: Jay S. Walker, Robert C. Tedesco, James A. Jorasch, Daniel E. Tedesco, Michael W. Patterson
  • Patent number: 7306161
    Abstract: The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory card can include a chamfer and/or a raised portion that allows the memory card to be more easily grabbed by a human hand (or mechanical device) and also provides additional room to store passive devices such as capacitors and/or resistors. Because different electronic devices use different types of memory cards, an adaptor is provided that allows the memory cards disclosed herein to be used in ports or connectors on electronic devices that are meant for other types of memory cards.
    Type: Grant
    Filed: November 23, 2004
    Date of Patent: December 11, 2007
    Assignee: SanDisk Corporation
    Inventors: Hem P. Takiar, Michael W. Patterson
  • Patent number: 5718038
    Abstract: An electronic assembly for connecting to an electronic system is disclosed which includes, in one embodiment, a connector having a group of contacts, each contact having a mating portion and an interconnect finger. A first circuitry module includes a group of leads providing a signal path to electronic components contained therewithin, wherein each of the leads is coupled directly to an interconnect finger of a corresponding one of the group of connector contacts. A protective body is rigidly coupled to the first connector and is formed to encase the first circuitry module and to provide support and protection to the circuitry module. In another embodiment suitable for a PCMCIA card assembly, each of a group of leads of a leaded chip-carrier module is directly connected to interconnect fingers of the connector.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: February 17, 1998
    Assignee: National Semiconductor Corporation
    Inventors: Hem P. Takiar, Michael W. Patterson
  • Patent number: 5715594
    Abstract: A portable peripheral card for an electrical device is disclosed that has an injected molded housing package. In one aspect of the invention, the peripheral card has a printed circuit board, a female electrical connector, and a solid one-piece injected molded package. The printed circuit board has electrical components mounted thereon and the female electrical connector is attached to the printed circuit board to permit communications between the electrical components on the printed circuit board and the electrical device. The solid one-piece package encapsulates the printed circuit board and the electrical components yet exposes a portion of the electrical connector to facilitate electrical connections between the printed circuit board and the electrical device. In one preferred embodiment, the portable peripheral card is a PCMCIA card. Methods of manufacturing such peripheral cards are also disclosed.
    Type: Grant
    Filed: June 14, 1996
    Date of Patent: February 10, 1998
    Assignee: National Semiconductor Corporation
    Inventors: Michael W. Patterson, Hem P. Takiar
  • Patent number: 5594204
    Abstract: An apparatus directed to portable peripheral cards is disclosed which provide protection against electro-static discharge and electro-magnetic interference. Furthermore, this apparatus provides a solid housing which affords a strong protective structure for the PC board and also protects the ICs housed inside the peripheral card from being easily accessed.
    Type: Grant
    Filed: July 25, 1995
    Date of Patent: January 14, 1997
    Assignee: National Semiconductor Corporation
    Inventors: Carl J. Taylor, Michael W. Patterson, Gordon Force
  • Patent number: 5563450
    Abstract: A peripheral card includes a two-part metal cover mounting a printed wiring board on a U-shaped plastic frame. The wiring board is spaced from inside surfaces of the cover preferably by a pair spring clips mountable on side edges of the wiring board, each clip having an apertured intermediate bight portion overlying and in aperture burr scraped contact with ground contact pads on the board. Barbed-end spring fingers extend integrally from the bight portion preferably toward the board side edge to which it affixed and into scraped contact with respective ones of the metal cover parts as the metal cover parts are assembled together. The clips hold the board from movement in the cover and electrically ground any static electrical charges on the metal cover parts to the contact pads and to a ground socket in the frame, and electrically ground the metal cover parts to provide electromagnetic shielding of the electrical circuitry on the wiring board.
    Type: Grant
    Filed: January 27, 1995
    Date of Patent: October 8, 1996
    Assignee: National Semiconductor Corporation
    Inventors: Ronald S. Bader, Michael W. Patterson
  • Patent number: 5554821
    Abstract: A portable peripheral card for an electrical device is disclosed that has an injected molded housing package. In one aspect of the invention, the peripheral card has a printed circuit board, a female electrical connector, and a solid one-piece injected molded package. The printed circuit board has electrical components mounted thereon and the female electrical connector is attached to the printed circuit board to permit communications between the electrical components on the printed circuit board and the electrical device. The solid one-piece package encapsulates the printed circuit board and the electrical components yet exposes a portion of the electrical connector to facilitate electrical connections between the printed circuit board and the electrical device. In one preferred embodiment, the portable peripheral card is a PCMCIA card.
    Type: Grant
    Filed: July 15, 1994
    Date of Patent: September 10, 1996
    Assignee: National Semiconductor Corporation
    Inventors: Michael W. Patterson, Hem P. Takiar
  • Patent number: 5530622
    Abstract: An electronic assembly for connecting to an electronic system is disclosed which includes, in one embodiment, a connector having a group of contacts, each contact having a mating portion and an interconnect finger. A first circuitry module includes a group of leads providing a signal path to electronic components contained therewithin, wherein each of the leads is coupled directly to an interconnect finger of a corresponding one of the group of connector contacts. A protective body is rigidly coupled to the first connector and is formed to encase the first circuitry module and to provide support and protection to the circuitry module. In another embodiment suitable for a PCMCIA card assembly, each of a group of leads of a leaded chip-carrier module is directly connected to interconnect fingers of the connector.
    Type: Grant
    Filed: December 23, 1994
    Date of Patent: June 25, 1996
    Assignee: National Semiconductor Corporation
    Inventors: Hem P. Takiar, Michael W. Patterson
  • Patent number: 5099101
    Abstract: An automatic laser trimming apparatus (30) for semiconductor integrated chip packages removes dambars (16) and performs deflashing and degating operations. The apparatus combines a laser machining subsystem (32, 36) with a machine vision subsystem (38, 40) to accurately locate and treat the dambars on an integrated circuit package. A defocusing lens (54) is used to attenuate the intensity of the laser beam (34) to permit a single laser to perform both the dambar removal and deflashing operations. In addition, an improved fixture (46) is provided to enhance the removal of smoke and debris from the processing station and to provide improved backlighting thereby enhancing resolution.
    Type: Grant
    Filed: August 31, 1990
    Date of Patent: March 24, 1992
    Assignee: National Semiconductor Corporation
    Inventors: Michael A. Millerick, Michael W. Patterson
  • Patent number: 4978830
    Abstract: An automatic laser trimming apparatus (30) for semiconductor integrated chip packages removes dambars (16) and performs deflashing and degating operations. The apparatus combines a laser machining subsystem (32, 36) with a machine vision subsystem (38, 40) to accurately locate the treat and dambars on an integrated circuit package. A defocusing lens (54) is used to attenuate the intensity of the laser beam (34) to permit a single laser to perform both the dambar removal and deflashing operations. In addition, an improved fixture (46) is provided to enhance the removal of smoke and debris from the processing station and to provide improved backlighting thereby enhancing resolution.
    Type: Grant
    Filed: February 27, 1989
    Date of Patent: December 18, 1990
    Assignee: National Semiconductor Corporation
    Inventors: Michael A. Millerick, Michael W. Patterson
  • Patent number: D523435
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: June 20, 2006
    Assignee: Sandisk Corporation
    Inventors: Hem P. Takiar, Michael W. Patterson
  • Patent number: D525623
    Type: Grant
    Filed: August 19, 2005
    Date of Patent: July 25, 2006
    Assignee: Sandisk Corporation
    Inventors: Hem P. Takiar, Michael W. Patterson
  • Patent number: D525978
    Type: Grant
    Filed: August 19, 2005
    Date of Patent: August 1, 2006
    Assignee: Sandisk Corporation
    Inventors: Hem P. Takiar, Michael W. Patterson
  • Patent number: D537081
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: February 20, 2007
    Assignee: Sandisk Corporation
    Inventors: Hem P. Takiar, Michael W. Patterson
  • Patent number: D538286
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: March 13, 2007
    Assignee: Sandisk Corporation
    Inventors: Hem P. Takiar, Michael W. Patterson
  • Patent number: D548740
    Type: Grant
    Filed: May 19, 2005
    Date of Patent: August 14, 2007
    Assignee: SanDisk Corporation
    Inventors: Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath