Patents by Inventor Michael Wagaman

Michael Wagaman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Highly stable packaging substrates
    Patent number: 6812311
    Abstract: A method of producing a highly stable packaging substrate in which are provided a first precursor having a first backbone and a first ethynyl group, and a second precursor having a second backbone and a second ethynyl group. Furthermore provided is a crosslinker having a first and a second reactive group. The first precursor, the second precursor, the crosslinker, and a solvent are applied onto a surface to form an electrically insulating layer. The first ethynyl group is reacted with the first reactive group in a first carbon-carbon bond formation reaction and the second ethynyl group is reacted with the second reactive group in a second carbon-carbon bond formation reaction to crosslink the first backbone with the second backbone, thereby forming the packaging substrate. The solvent is removed in a further step.
    Type: Grant
    Filed: October 18, 2001
    Date of Patent: November 2, 2004
    Assignee: Honeywell International Inc.
    Inventors: Thomas McCarthy, Michael Wagaman, David Schwind
  • Highly stable packaging substrates
    Publication number: 20020132053
    Abstract: A method of producing a highly stable packaging substrate in which are provided a first precursor having a first backbone and a first ethynyl group, and a second precursor having a second backbone and a second ethynyl group. Furthermore provided is a crosslinker having a first and a second reactive group. The first precursor, the second precursor, the crosslinker, and a solvent are applied onto a surface to form an electrically insulating layer. The first ethynyl group is reacted with the first reactive group in a first carbon-carbon bond formation reaction and the second ethynyl group is reacted with the second reactive group in a second carbon-carbon bond formation reaction to crosslink the first backbone with the second backbone, thereby forming the packaging substrate. The solvent is removed in a further step.
    Type: Application
    Filed: October 18, 2001
    Publication date: September 19, 2002
    Applicant: Honeywell International, Inc.
    Inventors: Thomas McCarthy, Michael Wagaman, David Schwind
  • Highly stable packaging substrates
    Patent number: 6346296
    Abstract: A method of producing a highly stable packaging substrate in which are provided a first precursor having a first backbone and a first ethynyl group, and a second precursor having a second backbone and a second ethynyl group. Furthermore provided is a crosslinker having a first and a second reactive group. The first precursor, the second precursor, the crosslinker, and a solvent are applied onto a surface to form an electrically insulating layer. The first ethynyl group is reacted with the first reactive group in a first carbon-carbon bond formation reaction and the second ethynyl group is reacted with the second reactive group in a second carbon-carbon bond formation reaction to crosslink the first backbone with the second backbone, thereby forming the packaging substrate. The solvent is removed in a further step.
    Type: Grant
    Filed: September 14, 1999
    Date of Patent: February 12, 2002
    Assignee: AlliedSignal Inc.
    Inventors: Thomas McCarthy, Michael Wagaman, David Schwind