Abstract: A computer system is provided that includes a storage system, at least one transceiver, and a processing system with at least one hardware processor. The storage system stores a first list pair. The transceiver receives electronic data messages that each include a respective data transaction request. The processing system determines how the new data transaction request should be processed based on which communication protocol was used to submit the request. Updates regarding the first list pair are sent out to non-party client computer systems using different communication protocols, where one is faster than the other, but the slower update includes private data therein.

Abstract: A security system with a steering wheel adjacent to a seat with a seat back which can swing forward to a predetermined position. The seat can also slide longitudinally between a rearward and forward position. The system includes a headrest mounted on the seat back to reiprocate between a retracted position and a locking position. With the seat back in the predetermined position and the seat in the forward position, the headrest is movable from said retracted position forward and down to the locking position to capture the steering wheel between the headrest and the seat back.

Abstract: A method of making a connection to a surface of an electronic carrier, the method comprising the steps of: providing a mass of malleable material on the surface of the electronic carrier; connecting the mass to said surface; and extruding the mass into a bore of a tool in order to elongate the mass so as to create a pin, or pin-like, structure having an end to which a further connection may be made.

Abstract: A method of making a connection to a surface of an electronic carrier, the method comprising the steps of: providing a mass of malleable material on the surface of the electronic carrier; connecting the mass to said surface; and extruding the mass into a bore of a tool in order to elongate the mass so as to create a pin, or pin-like, structure having an end to which a further connection may be made.

Abstract: A semiconductor device comprising at least one semiconductor chip, the or each semiconductor chip having a plurality of chip bonding pads, a package which encloses the at least one semiconductor chip, a first level interconnect comprising a printed circuit which overlies the at least one semiconductor chip in the package and extends externally of the package to provide a plurality of outer leads, and a second level interconnect comprising means for electrically connecting the chip bonding pads to selected contacts on the printed circuit, which contacts overlie the at least one semiconductor chip. The invention also relates to a method of manufacturing such a semiconductor device and to a method of assembling a semiconductor assembly.