Patents by Inventor Michael Wayne Cumbie

Michael Wayne Cumbie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded substrates
    Patent number: 11784072
    Abstract: Examples of molded substrates are described herein. In some examples, a molded substrate may support integrated circuitry. In some examples, the molded substrate and the integrated circuitry are included in a circuitry package for a replaceable print component. In some examples, the molded substrate is relatively flat. In some examples, molding remnants may be on the molded substrate.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: October 10, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael Wayne Cumbie, Paul David Schweitzer, Anthony Donald Studer, Gary Gerard Lutnesky, John Edward Davis
  • MOLDED SUBSTRATES
    Publication number: 20230110990
    Abstract: Examples of molded substrates are described herein. In some examples, a molded substrate may support integrated circuitry. In some examples, the molded substrate and the integrated circuitry are included in a circuitry package for a replaceable print component. In some examples, the molded substrate is relatively flat. In some examples, molding remnants may be on the molded substrate.
    Type: Application
    Filed: October 4, 2019
    Publication date: April 13, 2023
    Inventors: Michael Wayne Cumbie, Paul David Schweitzer, Anthony Donald Studer, Gary Gerard Lutnesky, John Edward Davis