Patents by Inventor Michael Wayne PELCZYNSKI

Michael Wayne PELCZYNSKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Backside-thinned image sensor using AlOsurface passivation
    Patent number: 8975668
    Abstract: A structure and method of manufacture is disclosed for a backside thinned imager that incorporates a conformal, Al2O3, low thermal budget, surface passivation. This passivation approach facilitates fabrication of backside thinned, backside illuminated, silicon image sensors with thick silicon absorber layer patterned with vertical trenches that are formed by etching the exposed back surface of a backside-thinned image sensor to control photo-carrier diffusion and optical crosstalk. A method of manufacture employing conformal, Al2O3, surface passivation approach is shown to provide high quantum efficiency and low dark current while meeting the thermal budget constraints of a finished standard foundry-produced CMOS imager.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: March 10, 2015
    Assignee: Intevac, Inc.
    Inventors: Kenneth A. Costello, Edward Yin, Michael Wayne Pelczynski, Verle W. Aebi
  • BACKSIDE-THINNED IMAGE SENSOR USING Al2O3 SURFACE PASSIVATION
    Publication number: 20130105928
    Abstract: A structure and method of manufacture is disclosed for a backside thinned imager that incorporates a conformal, Al2O3, low thermal budget, surface passivation. This passivation approach facilitates fabrication of backside thinned, backside illuminated, silicon image sensors with thick silicon absorber layer patterned with vertical trenches that are formed by etching the exposed back surface of a backside-thinned image sensor to control photo-carrier diffusion and optical crosstalk. A method of manufacture employing conformal, Al2O3, surface passivation approach is shown to provide high quantum efficiency and low dark current while meeting the thermal budget constraints of a finished standard foundry-produced CMOS imager.
    Type: Application
    Filed: September 14, 2012
    Publication date: May 2, 2013
    Applicant: INTEVAC, INC.
    Inventors: Kenneth A. COSTELLO, Edward YIN, Michael Wayne PELCZYNSKI, Verle W. AEBI