Abstract: The technology relates to depositing free-standing electrical devices on a substrate and electrically connecting two or more of the free-standing electrical devices with the aid of a bendable scoring lines. These bendable scoring lines allow the thin-film substrate to be bended, or folded, to form a specific shape. Electrical devices include electrochromic devices or solid state batteries.

Abstract: The technology relates to depositing free-standing electrical devices on a substrate and electrically connecting two or more of the free-standing electrical devices with the aid of a bendable scoring lines. These bendable scoring lines allow the thin-film substrate to be bended, or folded, to form a specific shape. Electrical devices include electrochromic devices or solid state batteries.

Abstract: Modulation of a waveform applied to a cathode of a sputtering deposition chamber regulates the sputtering rate and density and kinetic energy of ions in a sputtering deposition chamber. A waveform may include a pulsed DC waveform with a modulated AC signal superimposed on the pulsed DC waveform. The DC waveform may have a reverse voltage period. A reverse voltage limiting circuit is provided so as to limit the reverse voltage spike to a selected reverse voltage threshold. One may modulate various properties of the waveform to increase or decrease sputtering rates and thin-film quality.

Abstract: This disclosure describes systems and methods for regulating the density and kinetic energy of ions in a sputtering deposition chamber. A pulsed DC waveform with a modulated RF signal is generated and applied to the sputtering chamber. Upon termination of a cycle of the pulsed DC waveform, a reverse voltage spike is generated. This reverse voltage spike reverses the polarity of the cathode and anode of the sputtering chamber for some period of time. A reverse voltage limiting circuit is provided so as to limit the reverse voltage spike to a selected reverse voltage threshold. A controller may be employed to control the timing and duration of the application of the DC waveform, the timing and duration of the RF waveform, and the engagement of the reverse limiting circuit.