Patents by Inventor Michael Weitmann

Michael Weitmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing printed circuit boards
    Patent number: 5666722
    Abstract: A printed circuit board is made by producing recesses and/or holes in an electric insulating substrate by laser ablation. The recesses correspond to a desired pattern of conductor structures and/or holes. Conductive material is then deposited on substantially an entire face of the substrate. Conductive material is then removed from the substrate outside the desired pattern of conductor structures and/or holes.
    Type: Grant
    Filed: March 15, 1995
    Date of Patent: September 16, 1997
    Assignee: Hewlett-Packard Company
    Inventors: Wilhelm Tamm, Walter Olbrich, Siegfrid Dippon, Michael Weitmann, Si-Ty Lam