Abstract: An assembly includes a heat pipe and one or more fins. The heat pipe has an envelope with two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than the radius of curvature of the curved portions. Each fin comprises a plate. The plate has a hole through it. The hole is sized to accommodate the envelope. The hole has two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than a radius of curvature of the curved portions. The plate has at least one collar portion adjacent to the hole. The collar portion extends approximately in a direction normal to the plate. The collar portion is sized so as to accommodate the method of attachment of the fin to the envelope.

Abstract: An assembly includes a heat pipe and one or more fins. The heat pipe has an envelope with two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than the radius of curvature of the curved portions. Each fin comprises a plate. The plate has a hole through it. The hole is sized to accommodate the envelope. The hole has two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than a radius of curvature of the curved portions. The plate has at least one collar portion adjacent to the hole. The collar portion extends approximately in a direction normal to the plate. The collar portion is sized so as to accommodate the method of attachment of the fin to the envelope.

Abstract: An assembly includes a heat pipe and one or more fins. The heat pipe has an envelope with two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than the radius of curvature of the curved portions. Each fin comprises a plate. The plate has a hole through it. The hole is sized to accommodate the envelope. The hole has two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than a radius of curvature of the curved portions. The plate has at least one collar portion adjacent to the hole. The collar portion extends approximately in a direction normal to the plate. The collar portion is sized so as to accommodate the method of attachment of the fin to the envelope.

Abstract: An assembly includes a heat pipe and one or more fins. The heat pipe has an envelope with two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than the radius of curvature of the curved portions. Each fin comprises a plate. The plate has a hole through it. The hole is sized to accommodate the envelope. The hole has two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than a radius of curvature of the curved portions. The plate has at least one collar portion adjacent to the hole. The collar portion extends approximately in a direction normal to the plate. The collar portion is sized so as to accommodate the method of attachment of the fin to the envelope.

Abstract: A printed wiring board assembly is formed by mounting an insert having a pocket containing one or more standoffs in the cavity of a pallet. The pallet and the insert are both coupled to the bottom of a printed wiring board. A device having tinned leads and a tinned casing is positioned in the pocket of the insert above the standoffs. A solder preform is positioned in the pocket of insert, beneath the casing of the device. The assembly is placed in a soldering oven and heated to a at least a reflow temperature of the solder preform, whereby the device casing is joined to the insert and the device leads are coupled to solder pads on the printed wiring board.

Abstract: This disclosure is directed to maintaining a blanket of secondary vapor intermediate a hot primary vapor and the atmosphere, in a condensation heating facility, to prevent losses of the primary vapor to the atmosphere. A secondary liquid is transported through the secondary vapor into the hot primary vapors where the secondary liquid is vaporized to supplement the secondary vapor.

Abstract: This disclosure is directed to maintaining a blanket of secondary vapor intermediate a hot primary vapor and the atmosphere, in a condensation heating facility, to prevent losses of the primary vapor to the atmosphere. A secondary liquid is transported through the secondary vapor into the hot primary vapors where the secondary liquid is vaporized to supplement the secondary vapor.

Abstract: Articles are heated in a condensation heat transfer facility to effect soldering thereof by transporting said articles into a body of hot saturated vapor within the facility. The hot saturated vapor condenses on, and gives up latent heat of vaporization to, the articles to effect solder reflow. The articles are subsequently quenched in a liquid prior to the withdrawal of the articles from the facility.