Abstract: A multi-layered, engineered-wood composite shake or shingle siding with weather-tight connections, edge-to-edge, between adjacent shakes or shingle siding planks or pieces. One or more water drainage grooves or channels may be machined or cut into the faces of underlap and/or overlap portions. A shake generally is delineated by a pressed-in groove or a machine-cut gap (e.g., “keyway”). For a shake near the end of a panel, a false keyway or partial keyway may be cut or machined into the end, thereby giving the appearance of a keyway when two ends are fitted together to form a lap joint. The number of shakes on a panel may vary.

Abstract: A method, apparatus, and logic (encoded within a computer-readable tangible storage media) are provided for detecting, at an intermediate device, a presence of a delay for a fax communication between a source device and a destination device in a network. The delay for the fax communication is sufficient to produce a failure of a corresponding fax operation. The intermediate device includes a buffer to receive packets and is disposed in the network between the source and destination devices. A first time value of the buffer is adjusted at the intermediate device in response to detection of the delay to modify the delay to be within a range enabling the corresponding fax operation to be performed.

Abstract: A MEMS based thermoacoustic cryo-cooler for thermal management of cryogenic electronic devices. The cryogenic cooling system can be integrated directly into a cryogenic electronic device. A vertical comb-drive provides an acoustic source through a driving plate to a resonant tube. By exciting a standing wave within the resonant tube, a temperature difference develops across a stack in the tube, thereby enabling heat exchange between heat exchangers. A tapered resonant tube improves the efficiency of the cooling system, compared with a simple cylinder configuration, leading to reduced harmonics and strong standing waves.

Abstract: A MEMS based thermoacoustic cryo-cooler for thermal management of cryogenic electronic devices and a resonant tube used therein. A vertical comb-drive can provides an acoustic source through a driving plate to the resonant tube. By exciting a standing wave within the resonant tube, a temperature difference develops across a stack in the tube, thereby enabling heat exchange between heat exchangers. A tapered resonant tube improves the efficiency of the cooling system, compared with a simple cylinder configuration, leading to reduced harmonics and strong standing waves.

Abstract: Multi-levels are etched into silicon. The levels are etched through a combination of crosslinking photoresist, multiple photoresist patterning and development, wet etching and/or dry-etching. RIE, DRIE, and other etch techniques can be used during different steps. The multilevel structure may thereby be produced at commercially acceptable production rates allowing the method of the present application to be used in volume production of multilevel structures.

Abstract: Multi-levels are etched into silicon. The levels are etched through a combination of crosslinking photoresist, multiple photoresist patterning and development, wet etching and/or dry-etching. RIE, DRIE, and other etch techniques can be used during different steps. The multilevel structure may thereby be produced at commercially acceptable production rates allowing the method of the present application to be used in volume production of multilevel structures.

Abstract: A MEMS based thermoacoustic cryo-cooler for thermal management of cryogenic electronic devices. The cryogenic cooling system can be integrated directly into a cryogenic electronic device. A vertical comb-drive provides an acoustic source through a driving plate to a resonant tube. By exciting a standing wave within the resonant tube, a temperature difference develops across a stack in the tube, thereby enabling heat exchange between heat exchangers. A tapered resonant tube improves the efficiency of the cooling system, compared with a simple cylinder configuration, leading to reduced harmonics and strong standing waves.

Abstract: Multi-levels are etched into silicon. The levels are etched through a combination of crosslinking photoresist, multiple photoresist patterning and development, wet etching and/or dry-etching. RIE, DRIE, and other etch techniques can be used during different steps. The multilevel structure may thereby be produced at commercially acceptable production rates allowing the method of the present application to be used in volume production of multilevel structures.