Patents by Inventor Michael WILLHOFF

Michael WILLHOFF has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Self-stopping polishing composition and method for high topological selectivity
    Patent number: 12116502
    Abstract: The invention provides a chemical-mechanical polishing composition comprising: (a) an abrasive selected from a ceria abrasive, a zirconia abrasive, and a combination thereof; (b) a self-stopping agent selected from a compound of formula (I), (c) optionally a nonionic polymer; (d) a cationic monomer compound; and (e) water, wherein the polishing composition has a pH of about 5.5 to about 8. The invention also provides a method of chemically-mechanically polishing a substrate, especially a substrate comprising silicon oxide and optionally polysilicon, using said composition.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: October 15, 2024
    Assignee: CMC Materials LLC
    Inventors: Juyeon Chang, Sudeep Pallikkara Kuttiatoor, Sajo Naik, Elliot Knapton, Jinfeng Wang, Michael Willhoff
  • SELF-STOPPING POLISHING COMPOSITION AND METHOD FOR HIGH TOPOLOGICAL SELECTIVITY
    Publication number: 20220195244
    Abstract: The invention provides a chemical-mechanical polishing composition comprising: (a) an abrasive selected from a ceria abrasive, a zirconia abrasive, and a combination thereof; (b) a self-stopping agent selected from a compound of formula (I), (c) optionally a nonionic polymer; (d) a cationic monomer compound; and (e) water, wherein the polishing composition has a pH of about 5.5 to about 8. The invention also provides a method of chemically-mechanically polishing a substrate, especially a substrate comprising silicon oxide and optionally polysilicon, using said composition.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 23, 2022
    Inventors: Juyeon CHANG, Sudeep PALLIKKARA KUTTIATOOR, Sajo NAIK, Elliot KNAPTON, Jinfeng WANG, Michael WILLHOFF
  • CMP compositions selective for oxide and nitride with high removal rate and low defectivity
    Patent number: 8916061
    Abstract: The invention relates to a chemical-mechanical polishing composition comprising a ceria abrasive, cations of one or more lanthanide metals, one or more nonionic polymers, water, and optionally one or more additives. The invention further relates to a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate comprises one or more of silicon oxide, silicon nitride, and polysilicon.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: December 23, 2014
    Assignee: Cabot Microelectronics Corporation
    Inventors: Brian Reiss, Michael Willhoff, Daniel Mateja
  • CMP COMPOSITIONS SELECTIVE FOR OXIDE AND NITRIDE WITH HIGH REMOVAL RATE AND LOW DEFECTIVITY
    Publication number: 20130244432
    Abstract: The invention relates to a chemical-mechanical polishing composition comprising a ceria abrasive, cations of one or more lanthanide metals, one or more nonionic polymers, water, and optionally one or more additives. The invention further relates to a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate comprises one or more of silicon oxide, silicon nitride, and polysilicon.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 19, 2013
    Inventors: Brian REISS, Michael WILLHOFF, Daniel MATEJA