Patents by Inventor Michael Winkel
Michael Winkel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11047263Abstract: A method for operating a steam turbine where steam turbine has at least two sub-turbines, wherein the steam turbine is paired with a steam turbine controller which has a sub-turbine controller for each of the sub-turbines, and each sub-turbine controller compares respective target values with respective actual values of the respective sub-turbine during operation in order to determine a respective control deviation for each sub-turbine.Type: GrantFiled: August 22, 2018Date of Patent: June 29, 2021Assignee: Siemens Energy GLobal GmbH & Co. KGInventors: Martin Bennauer, Marc Borowski, Christoph Schindler, David Veltmann, Michael Winkel
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Patent number: 11008895Abstract: A method for operating a steam turbine where steam turbine has at least two sub-turbines, wherein the steam turbine is paired with a steam turbine controller which has a sub-turbine controller for each of the sub-turbines, and each sub-turbine controller compares respective target values with respective actual values of the respective sub-turbine during operation in order to determine a respective control deviation for each sub-turbine.Type: GrantFiled: August 22, 2018Date of Patent: May 18, 2021Assignee: Siemens Energy GLobal GmbH & Co. KGInventors: Martin Bennauer, Marc Borowski, Christoph Schindler, David Veltmann, Michael Winkel
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Patent number: 10959339Abstract: A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.Type: GrantFiled: January 15, 2018Date of Patent: March 23, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bruce J. Chamberlin, Andreas Huber, Harald Huels, Thomas-Michael Winkel
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Publication number: 20200256217Abstract: A method for operating a steam turbine where steam turbine has at least two sub-turbines, wherein the steam turbine is paired with a steam turbine controller which has a sub-turbine controller for each of the sub-turbines, and each sub-turbine controller compares respective target values with respective actual values of the respective sub-turbine during operation in order to determine a respective control deviation for each sub-turbine.Type: ApplicationFiled: August 22, 2018Publication date: August 13, 2020Applicant: Siemens AktiengesellschaftInventors: Martin Bennauer, Marc Borowski, Christoph Schindler, David Veltmann, Michael Winkel
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Patent number: 10734317Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.Type: GrantFiled: June 12, 2019Date of Patent: August 4, 2020Assignee: International Business Machines CorporationInventors: Andreas Huber, Harald Huels, Stefano S. Oggioni, Thomas Strach, Thomas-Michael Winkel
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Patent number: 10480405Abstract: A method for coupling a first sub-shaft, which has a first turbomachine and a generator connected to a mains supply, to a second sub-shaft, which has a second turbomachine, by means of an overrunning clutch, has the following steps: a) rotating the second sub-shaft with a starting rotational speed which is lower than the rotational speed of the first sub-shaft; b) measuring the mains frequency of the mains supply; c) measuring a differential angle between the first sub-shaft and the second sub-shaft; d) accelerating the second sub-shaft with an acceleration value which is produced using the mains frequency measured in step b), the differential angle and the starting rotational speed, and therefore the overrunning clutch couples the two sub-shafts to each other with a previously determined target coupling angle.Type: GrantFiled: June 30, 2016Date of Patent: November 19, 2019Assignee: Siemens AktiengesellschaftInventor: Michael Winkel
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Publication number: 20190295938Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.Type: ApplicationFiled: June 12, 2019Publication date: September 26, 2019Inventors: Andreas Huber, Harald Huels, Stefano S. Oggioni, Thomas Strach, Thomas-Michael Winkel
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Patent number: 10354946Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.Type: GrantFiled: April 5, 2018Date of Patent: July 16, 2019Assignee: International Business Machines CorporationInventors: Andreas Huber, Harald Huels, Stefano S. Oggioni, Thomas Strach, Thomas-Michael Winkel
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Patent number: 10253655Abstract: A method for coupling a gas turbine connected to a generator and a steam turbine, wherein the generator has an excitation winding, the excitation of which can be changed by changing an excitation current flowing through the excitation winding, the method having the following steps: a) accelerating and/or decelerating the steam turbine in such a way that the coupling takes place with a target coupling angle; b) if necessary, changing the excitation current such that the excitation of the excitation winding changed in this way leads to a changed polar wheel angle, wherein the polar wheel angle is changed in such a way that the achieving of the target coupling angle is supported. In an analogous method, the polar wheel angle is changed for the purposes of improved decoupling. A corresponding control device is for coupling a gas turbine connected to a generator.Type: GrantFiled: October 5, 2015Date of Patent: April 9, 2019Assignee: Siemens AktiengesellschaftInventors: Martin Berning, Marc Diefenbach, Marcel Langer, Martin Ophey, Dennis Schlüter, Michael Winkel
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Publication number: 20190010865Abstract: A method for coupling a first sub-shaft, which has a first turbomachine and a generator connected to a mains supply, to a second sub-shaft, which has a second turbomachine, by means of an overrunning clutch, has the following steps: a) rotating the second sub-shaft with a starting rotational speed which is lower than the rotational speed of the first sub-shaft; b) measuring the mains frequency of the mains supply; c) measuring a differential angle between the first sub-shaft and the second sub-shaft; d) accelerating the second sub-shaft with an acceleration value which is produced using the mains frequency measured in step b), the differential angle and the starting rotational speed, and therefore the overrunning clutch couples the two sub-shafts to each other with a previously determined target coupling angle.Type: ApplicationFiled: June 30, 2016Publication date: January 10, 2019Applicant: Siemens AktiengesellschaftInventor: Michael Winkel
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Patent number: 10149388Abstract: A method for embedding a discrete electrical device in a printed circuit board (PCB) is provided, which includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to a conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first device contact and the conductive structure in the first layer; and establishing a second electrical connection between a second device contact and a second layer, the second layer being one of the conductive layers of a second horizontal core section.Type: GrantFiled: June 7, 2016Date of Patent: December 4, 2018Assignee: INTERNATIONAL BUSINESS MACHINES, CORPORATIONInventors: Bruce J. Chamberlin, Andreas Huber, Harald Huels, Thomas Strach, Thomas-Michael Winkel
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Publication number: 20180228028Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.Type: ApplicationFiled: April 5, 2018Publication date: August 9, 2018Inventors: Andreas Huber, Harald Huels, Stefano S. Oggioni, Thomas Strach, Thomas-Michael Winkel
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Patent number: 10010000Abstract: A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.Type: GrantFiled: May 19, 2016Date of Patent: June 26, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bruce J. Chamberlin, Andreas Huber, Harald Huels, Thomas-Michael Winkel
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Patent number: 9980385Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.Type: GrantFiled: April 24, 2017Date of Patent: May 22, 2018Assignee: International Business Machines CorporationInventors: Andreas Huber, Harald Huels, Stefano S. Oggioni, Thomas Strach, Thomas-Michael Winkel
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Publication number: 20180139851Abstract: A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.Type: ApplicationFiled: January 15, 2018Publication date: May 17, 2018Inventors: Bruce J. CHAMBERLIN, Andreas HUBER, Harald HUELS, Thomas-Michael WINKEL
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Publication number: 20180027659Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.Type: ApplicationFiled: April 24, 2017Publication date: January 25, 2018Inventors: Andreas Huber, Harald Huels, Stefano S. Oggioni, Thomas Strach, Thomas-Michael Winkel
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Patent number: 9839131Abstract: Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.Type: GrantFiled: October 21, 2015Date of Patent: December 5, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bruce J. Chamberlin, Andreas Huber, Harald Huels, Thomas Strach, Thomas-Michael Winkel
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Publication number: 20170306800Abstract: A method for coupling a gas turbine connected to a generator and a steam turbine, wherein the generator has an excitation winding, the excitation of which can be changed by changing an excitation current flowing through the excitation winding, the method having the following steps: a) accelerating and/or decelerating the steam turbine in such a way that the coupling takes place with a target coupling angle; b) if necessary, changing the excitation current such that the excitation of the excitation winding changed in this way leads to a changed polar wheel angle, wherein the polar wheel angle is changed in such a way that the achieving of the target coupling angle is supported. In an analogous method, the polar wheel angle is changed for the purposes of improved decoupling. A corresponding control device is for coupling a gas turbine connected to a generator.Type: ApplicationFiled: October 5, 2015Publication date: October 26, 2017Applicant: Siemens AktiengesellschaftInventors: Martin Berning, Marcel Langer, Martin Ophey, Dennis Schlüter, Michael Winkel
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Patent number: 9709625Abstract: A method for determining power consumption of a power domain within an integrated circuit is presented. In a first step, a local power supply impedance profile (Z(f)) of this power domain is determined. Subsequently, a local time-resolved power supply voltage (U(t)) is measured while a well-defined periodic activity is executed in power domain. A set of time-domain measured voltage data (U(t)) is thus accumulated and transformed into the frequency domain to yield a voltage spectrum (U(f)). A current spectrum I(t) is calculated from this voltage profile (U(f)) by using the power supply impedance profile Z(f) of this power domain as I(t)=Ff?1{U(f)/Z(f)}. Finally, a time-resolved power consumption spectrum P(t) is determined from measured voltage spectrum U(t)) and calculated current spectrum (I(t)). This power consumption (P(t)) may be compared with a reference (Pref(t)) to verify whether power consumption within power domain matches expectations.Type: GrantFiled: June 28, 2011Date of Patent: July 18, 2017Assignee: International Business Machines CorporationInventors: Martin Eckert, Roland Frech, Claudio Siviero, Jochen Supper, Otto A. Torreiter, Thomas-Michael Winkel
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Patent number: 9673179Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.Type: GrantFiled: July 20, 2016Date of Patent: June 6, 2017Assignee: International Business Machines CorporationInventors: Andreas Huber, Harald Huels, Stefano S. Oggioni, Thomas Strach, Thomas-Michael Winkel