Abstract: The invention relates to a method and a robot (5) and/or robot controller (17) for validation of programmed workflow sequences and/or teaching programs (20) of the robot (5) in a work cell (2), wherein the robot (5) is preferably mounted on or next to a processing machine, in particular an injection molding machine (4), and designed for the extraction, handling, manipulation or further processing of injection-molded parts (3) which have just been produced. The robot controller (17) is designed to reproduce a virtual twin or robot model (21), respectively, in particular a virtual representation of the plant or work cell (2), respectively, at the output location, in particular a display or touch screen (16), whereby at least the injection molding machine is represented as part of the work cell, and further production resources of the plant or work cell (2), which are preferably automatically detected and represented.

Abstract: The invention describes a robot (5) and/or robot controller (17) and a method for validation of programmed workflow sequences or teaching programs (20) of a robot (5) preferably with a robot controller (17), wherein the robot (5) is preferably mounted on or next to a processing machine, in particular an injection molding machine (4), and serves for the extraction, handling, manipulation or further processing of injection-molded parts (3) which have just been produced. The travel parameters, equipment features and functionalities of the physical robot (5) are stored in a configuration file (27) on the control side. The robot controller (17) creates a virtual robot model (21) from these stored data. For validation of a workflow sequence, the robot controller (17) uses the current teaching program (20) in the robot controller (17) whereby the visualization of the workflow sequence is displayed directly on an output unit of the robot controller (17).

Abstract: An optoelectronic component has at least one lead frame section, wherein an optoelectronic element is arranged on the lead frame section, a mold material is applied at least on a first face of the lead frame section and adhesively connected to the lead frame section by the first face, the lead frame section consists of a predetermined material, a part of the first face of the lead frame section is provided with a coating, a region of the first face is free of the coating, and the mold material connects to the material of the lead frame section in the free region.

Abstract: A semiconductor component and an illumination device is disclosed. In an embodiment the semiconductor component includes a semiconductor chip configured to generate a primary radiation having a first peak wavelength and a radiation conversion element arranged on the semiconductor chip. The radiation conversion element includes a quantum structure that converts the primary radiation at least partly into secondary radiation having a second peak wavelength and a substrate that is transmissive to the primary radiation.

Abstract: An optoelectronic component may include an optoelectronic semiconductor chip having an upper side and a lower side. An emitting region may be formed on the upper side. The emitting region may be configured to emit electromagnetic radiation. A subsurface, forming the emitting region, of the upper side may be smaller than a total surface of the upper side. A collimating optical element may be arranged over the emitting region.

Abstract: A radiation emitting device is disclosed. In an embodiment a radiation emitting device includes a pixelated optoelectronic semiconductor chip configured to emit a first radiation having a first peak wavelength, a conversion element or color control medium configured to convert at least a portion of the first radiation into a second radiation having a second peak wavelength and a color control element including a semiconductor diode configured to absorb a portion of the first and/or second radiation, wherein devise is configured to emit radiation of a first color temperature composed mainly of the first and second radiations when a reverse voltage is applied to the semiconductor diode and to emit radiation of a second color temperature composed mainly of the first and second radiations and a third radiation with a third peak wavelength generated by the absorbed first and/or second radiation in the semiconductor diode when a forward voltage is applied to the semiconductor diode.

Abstract: A gasket (20) adapted for a microwave oven or a cooking oven with microwave heating function, that includes at least one elastic material and includes a front portion (30) and a rear portion (32), wherein the front portion (30) of the gasket (20) is an electrically non-conductive material, whereas the rear portion (32) of the gasket (20) is an electrically conductive material.

Abstract: A semiconductor component and an illumination device is disclosed. In an embodiment the semiconductor component includes a semiconductor chip configured to generate a primary radiation having a first peak wavelength and a radiation conversion element arranged on the semiconductor chip. The radiation conversion element includes a quantum structure that converts the primary radiation at least partly into secondary radiation having a second peak wavelength and a substrate that is transmissive to the primary radiation.

Abstract: A microwave oven or multifunctional oven with microwave heating function. The oven includes a cavity with an open front side and a front frame enclosing at least partially a front portion of the cavity. The cavity and the front frame include metal sheet. The front frame is connected to the cavity by fixing elements. A gap is formed between the cavity and the front frame. The gap encloses at least partially the front portion of the cavity and the front frame encloses the gap. The oven includes a door covering the open front side and the gap in a closed state of the door. The gap is at least partially filled by a gasket at least part of which includes one or more materials having low heat conductivity, so that the front frame is thermally decoupled from the cavity by the part of the gasket or the gap.

Abstract: An optoelectronic lighting device includes a black housing including a cavity, wherein the cavity includes a base, a semiconductor component is arranged on the base of the cavity with an underside of a main body facing the base, and the cavity is filled with a reflective material from the base up to a predetermined height, which is smaller than a height of a top side of the main body relative to the base of the cavity such that electromagnetic radiation emerging from the main body through side faces may be reflected by the reflective material back in the direction of the side faces to couple reflected electromagnetic radiation into the main body such that at least part of the electromagnetic radiation coupled in may emerge again from the main body through the top side of the main body.

Abstract: A radiation emitting device is disclosed. In an embodiment a radiation emitting device includes a pixelated optoelectronic semiconductor chip configured to emit a first radiation having a first peak wavelength, a conversion element or color control medium configured to convert at least a portion of the first radiation into a second radiation having a second peak wavelength and a color control element including a semiconductor diode configured to absorb a portion of the first and/or second radiation, wherein devise is configured to emit radiation of a first color temperature composed mainly of the first and second radiations when a reverse voltage is applied to the semiconductor diode and to emit radiation of a second color temperature composed mainly of the first and second radiations and a third radiation with a third peak wavelength generated by the absorbed first and/or second radiation in the semiconductor diode when a forward voltage is applied to the semiconductor diode.

Abstract: A radiation-emitting semiconductor device includes a housing body having a chip mounting area, a chip connection region, a radiation-emitting semiconductor chip, and a light-absorbing material, wherein the radiation-emitting semiconductor chip is fixed to the chip connection region, the chip connection region is covered with the light-absorbing material at selected locations at which the chip connection region is not covered by the radiation-emitting semiconductor chip, the radiation-emitting semiconductor chip is free of the light-absorbing material in selected locations, the housing body has a cavity in which the at least one radiation-emitting semiconductor chip is arranged, the chip mounting area is a surface of the housing body which abuts the cavity, and the chip mounting area is free of the light-absorbing material in selected locations remote from the chip connection region.

Abstract: An optoelectronic component has at least one lead frame section, wherein an optoelectronic element is arranged on the lead frame section, a mold material is applied at least on a first face of the lead frame section and adhesively connected to the lead frame section by the first face, the lead frame section consists of a predetermined material, a part of the first face of the lead frame section is provided with a coating, a region of the first face is free of the coating, and the mold material connects to the material of the lead frame section in the free region.

Abstract: An optoelectronic component includes a first lead frame section and a second lead frame section spaced apart from one another, and having an optoelectronic semiconductor chip arranged on the first lead frame section and the second lead frame section, wherein the first lead frame section and the second lead frame section respectively have an upper side, a lower side and a first side flank extending between the upper side and the lower side, a first lateral solder contact surface of the optoelectronic component is formed on the first side flank of the first lead frame section, and the first lateral solder contact surface is formed by a recess arranged on the first side flank of the first lead frame section and extends from the upper side to the lower side of the first lead frame section.

Abstract: A microwave oven includes an oven muffle, a high-frequency oscillator for generating microwaves propagating within the oven muffle, an opening within the muffle wall of the oven muffle for passing a rotatable shaft of a motor through the muffle wall, and an element for suppressing microwave leakage through the opening. The element for suppressing microwave leakage is arranged at a distance to the muffle wall by a motor mounting element bearing the motor, such that there is no direct physical contact between the muffle wall and the suppression element.

Abstract: The invention relates to a device for handling and/or transporting workpieces (5), in particular for removal of injection-molded items from an injection-molding machine, wherein a handling robot (4) having a programmable control and regulating unit (10) is provided that comprises a gripper (6) having at least one suction nozzle (7) for grasping of the workpiece (5) or fixating it by suction. In the gripper (6) of the handling robot (4) a distance-measuring device (8) for detection of the distance (a1+a2) from the gripper (6) to a reference point or a reference surface (9), for example to the mold tool half (2), which is preferably movable, with the workpiece (5), is provided. The measured value of the distance-measuring device (8) is fed into the control and regulation unit (10). The distance-measuring device (8) can be a light-transit time measuring device, in particular a time-of-flight (TOF) sensor.

Abstract: A method of producing an optoelectronic component includes providing a lead frame having an upper side including a contact region and a chip reception region raised relative to the contact region; arranging an electrically conductive element on the contact region; embedding the lead frame in a molded body, wherein the contact region is covered by the molded body, and the chip reception region and the electrically conductive element remain accessible on an upper side of the molded body; arranging an optoelectronic semiconductor chip on the chip reception region; and connecting the optoelectronic semiconductor chip and the electrically conductive element by a bonding wire.

Abstract: An optoelectronic lighting device includes a black housing including a cavity, wherein the cavity includes a base, a semiconductor component is arranged on the base of the cavity with an underside of a main body facing the base, and the cavity is filled with a reflective material from the base up to a predetermined height, which is smaller than a height of a top side of the main body relative to the base of the cavity such that electromagnetic radiation emerging from the main body through side faces may be reflected by the reflective material back in the direction of the side faces to couple reflected electromagnetic radiation into the main body such that at least part of the electromagnetic radiation coupled in may emerge again from the main body through the top side of the main body.

Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.

Abstract: A method of producing an optoelectronic component includes providing a lead frame having an upper side including a contact region and a chip reception region raised relative to the contact region; arranging an electrically conductive element on the contact region; embedding the lead frame in a molded body, wherein the contact region is covered by the molded body, and the chip reception region and the electrically conductive element remain accessible on an upper side of the molded body; arranging an optoelectronic semiconductor chip on the chip reception region; and connecting the optoelectronic semiconductor chip and the electrically conductive element by a bonding wire.