Abstract: Techniques for determining a prediction probability associated with a disengagement event are discussed herein. A first prediction probability can include a probability that a safety driver associated with a vehicle (such as an autonomous vehicle) may assume control over the vehicle. A second prediction probability can include a probability that an object in an environment is associated the disengagement event. Sensor data can be captured and represented as a top-down representation of the environment. The top-down representation can be input to a machine learned model trained to output prediction probabilities associated with a disengagement event. The vehicle can be controlled based the prediction probability and/or the interacting object probability.

Abstract: A modular furnace, in particular for the oxidative stabilization of a carbon fiber starting material comprising a cuboidal furnace chamber, on the upper face of which first deflecting rollers are arranged in a mutually spaced and parallel manner and on the lower face of which second deflecting rollers are arranged in a mutually spaced and parallel manner such that the carbon fiber starting material runs upwards and downwards in a laterally adjacent and slightly spaced manner so as to meander vertically in the area of the furnace chamber. A carbon fiber inlet locking device and a carbon fiber outlet locking device are provided on the upper face of the furnace chamber, and an air guiding device is connected to the furnace chamber. A supply air portion of the air guiding device is connected to a vertical air inlet side of the furnace chamber, and a discharge air portion of the air guiding device is fluidically connected to a furnace chamber vertical air outlet side opposite the vertical air inlet side.

Abstract: A heating device for producing carbon fibers from a thread-shaped fiber starting material, wherein the heating device has a central tubular induction heating element through which the fiber starting material is moved. The tubular induction heating element is surrounded by thermal insulation. At least one mid- to high-frequency induction coil is provided outside the thermal insulation, and an inert gas flows through the central induction heating element, in particular, for carbonizing and/or graphitizing the fiber starting material. For energy optimization, a first and a second tube element is provided on the outer side of the thermal insulation. The elements are made of material that is transparent to the induction field of the mid- to high-frequency induction coil and are spaced apart from one another by an annular gap through which the inert gas flows.

Abstract: A method for operating an internal combustion engine having a hardware structure including an engine control unit and a maintenance unit, an electronic engine identification module and an engine control program, the method having the steps: providing a computer program product via a network by which an engine identification and engine data are loaded together and are exchanged, wherein the computer program product is designed for uploading and/or downloading a maintenance software module by which the engine identification and the engine data are compiled; loading the computer program product onto a non-volatile storage medium; coupling the non-volatile storage medium to the maintenance unit of the hardware structure and executing the computer program product; exchanging the maintenance software module between the non-volatile storage medium and the maintenance unit; identifying the engine and compiling engine data by the maintenance software module and a hardware component of the hardware structure.

Abstract: A modular furnace, in particular for the oxidative stabilization of a carbon fiber starting material comprising a cuboidal furnace chamber, on the upper face of which first deflecting rollers are arranged in a mutually spaced and parallel manner and on the lower face of which second deflecting rollers are arranged in a mutually spaced and parallel manner such that the carbon fiber starting material runs upwards and downwards in a laterally adjacent and slightly spaced manner so as to meander vertically in the area of the furnace chamber. A carbon fiber inlet locking device and a carbon fiber outlet locking device are provided on the upper face of the furnace chamber, and an air guiding device is connected to the furnace chamber. A supply air portion of the air guiding device is connected to a vertical air inlet side of the furnace chamber, and a discharge air portion of the air guiding device is fluidically connected to a furnace chamber vertical air outlet side opposite the vertical air inlet side.

Abstract: A heating device for producing carbon fibers from a thread-shaped fiber starting material, wherein the heating device has a central tubular induction heating element through which the fiber starting material is moved. The tubular induction heating element is surrounded by thermal insulation. At least one mid- to high-frequency induction coil is provided outside the thermal insulation, and an inert gas flows through the central induction heating element, in particular, for carbonizing and/or graphitizing the fiber starting material. For energy optimization, a first and a second tube element is provided on the outer side of the thermal insulation. The elements are made of material that is transparent to the induction field of the mid- to high-frequency induction coil and are spaced apart from one another by an annular gap through which the inert gas flows.

Abstract: A method for operating an internal combustion engine having a hardware structure including an engine control unit and a maintenance unit, an electronic engine identification module and an engine control program, the method having the steps: providing a computer program product via a network by which an engine identification and engine data are loaded together and are exchanged, wherein the computer program product is designed for uploading and/or downloading a maintenance software module by which the engine identification and the engine data are compiled; loading the computer program product onto a non-volatile storage medium; coupling the non-volatile storage medium to the maintenance unit of the hardware structure and executing the computer program product; exchanging the maintenance software module between the non-volatile storage medium and the maintenance unit; identifying the engine and compiling engine data by the maintenance software module and a hardware component of the hardware structure.

Abstract: A master/slave arrangement of an electronic engine control device with an engine identification module. The electronic engine control device controls and regulates the internal combustion machine. The engine identification module includes at least one microprocessor and a memory building block for storing an engine identification as well as engine specifics. The electronic engine control device and the engine identification module exchange data through an engine cable harness. The engine identification module is arranged inseparably at the crank housing of the internal combustion machine. The engine identification module can be removed from the crank housing as well as from the engine cable harness only by being destroyed.

Abstract: A master/slave arrangement of an electronic engine control device with an engine identification module. The electronic engine control device controls and regulates the internal combustion machine. The engine identification module includes at least one microprocessor and a memory building block for storing an engine identification as well as engine specifics. The electronic engine control device and the engine identification module exchange data through an engine cable harness. The engine identification module is arranged inseparably at the crank housing of the internal combustion machine. The engine identification module can be removed from the crank housing as well as from the engine cable harness only by being destroyed.

Abstract: A precision laser based method of marking semiconductor wafers, packages, substrates or similar workpieces is provided. The workpieces have articles which may include die, chip scale packages, circuit patterns and the like. The marking occurs in a workpiece marking system and within a designated region relative to an article position. The method includes determining at least one location from which reference data is to be obtained using (a) information from which a location of an article is defined, and (b) a vision model of at least a portion of at least one article. Reference data is obtained to locate a feature on a first side of (a second) workpiece using at least one signal from a first sensor. The method further includes positioning a marking field relative to the workpiece so as to position a laser beam at a marking location on a second side of the workpiece. The positioning is based on the feature location.

Abstract: A precision laser based method of marking semiconductor wafers, packages, substrates or similar workpieces is provided. The workpieces have articles which may include die, chip scale packages, circuit patterns and the like. The marking occurs in a workpiece marking system and within a designated region relative to an article position. The method includes determining at least one location from which reference data is to be obtained using (a) information from which a location of an article is defined, and (b) a vision model of at least a portion of at least one article. Reference data is obtained to locate a feature on a first side of (a second) workpiece using at least one signal from a first sensor. The method further includes positioning a marking field relative to the workpiece so as to position a laser beam at a marking location on a second side of the workpiece. The positioning is based on the feature location.

Abstract: A system and method for inspecting machine readable marks on one side of a wafer without requiring transmission of radiant energy from another side of the wafer and through the wafer. The wafer has articles which may include die, chip scale packages, circuit patterns and the like. The marking occurs in a wafer marking system and within a designated region relative to an article position. The articles have a pattern on a first side. The method includes the steps of imaging a first side of the wafer, imaging a second side of the wafer, establishing correspondence between a portion of first side image and a portion of a second side image, and superimposing image data from the first and second sides to determine at least the position of a mark relative to an article.

Abstract: A precision laser based method of marking semiconductor wafers, packages, substrates or similar workpieces is provided. The workpieces have articles which may include die, chip scale packages, circuit patterns and the like. The marking occurs in a workpiece marking system and within a designated region relative to an article position. The method includes determining at least one location from which reference data is to be obtained using (a) information from which a location of an article is defined, and (b) a vision model of at least a portion of at least one article. Reference data is obtained to locate a feature on a first side of (a second) workpiece using at least one signal from a first sensor. The method further includes positioning a marking field relative to the workpiece so as to position a laser beam at a marking location on a second side of the workpiece. The positioning is based on the feature location.

Abstract: A system for semiconductor wafer marking is provided. The system includes: (a) a first positioning subsystem for positioning a laser marking field relative to a wafer, the positioning along a first direction; (b) an alignment vision subsystem; (c) a laser marker including a laser for marking a location within the marking field with a laser marking beam; (d) a calibration program for calibrating at least one subsystem of the system; and (e) a controller. The marking field is substantially smaller than the wafer, and the laser marker includes a scan lens for optically maintaining a spot formed by the beam on the wafer within an acceptable range about the location within the marking field so as to avoid undesirable mark variations associated with wafer sag or other variations in depth within the field.

Abstract: Surfaces of silicon wafers used in making computer chips are marked by dimples engraved by pulses of radiation from a Nd:YAG or Nd:YLF laser pumped by diode lasers (commonly called a DPY laser). A beam of radiation from the DPY laser is focused on and moved across the surface of a wafer so as to produce dimples in a cluster positioned on a microgrid subdividing elements of a dot-matrix representation of a text written in alpha-numeric or bar-code characters.

Abstract: A system and method for inspecting machine readable marks on one side of a wafer without requiring transmission of radiant energy from another side of the wafer and through the wafer. The wafer has articles which may include die, chip scale packages, circuit patterns and the like. The marking occurs in a wafer marking system and within a designated region relative to an article position. The articles have a pattern on a first side. The method includes the steps of imaging a first side of the wafer, imaging a second side of the wafer, establishing correspondence between a portion of first side image and a portion of a second side image, and superimposing image data from the first and second sides to determine at least the position of a mark relative to an article.