Patents by Inventor Michael Yahatz

Michael Yahatz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabrication of thermoelectric modules and solder for such fabrication
    Patent number: 5817188
    Abstract: A thermoelectric module is formed with a solder joint, the solder containing about 50 to 99 weight percent bismuth and about 50 to 1 weight percent antimony, between the thermoelectric elements and the connecting conductors. Also provided is a thermoelectric module having bismuth telluride elements coated with a conductive material that does not require a nickel or other diffusion barrier. Further provided are modules having conductors with a phosphorus-nickel surface. Methods of manufacturing and using such thermoelectric modules are further provided.
    Type: Grant
    Filed: September 16, 1996
    Date of Patent: October 6, 1998
    Assignee: Melcor Corporation
    Inventors: Michael Yahatz, James Harper