Abstract: A microdisplay having interface circuitry on the same silicon backplane to allow it to receive digital images and video in a variety of formats and convert same to field sequential color signals for generation of full color images. It includes column data processors having a comparator for each block of N-columns of pixels. Image data is double-buffered in SRAM memory cells located beneath the pixel electrodes, but not within each pixel. The stored data is logically associated with each pixel via the column data processors. Image compression is accomplished by converting RGB data to a variant of YUV data and sampling the color components of the converted data less frequently than the luminance components. The SRAM image buffer consumes a reduced amount of power. A temperature compensation scheme allows the temperature of the microdisplay to be sensed and the drive voltage to the pixel electrodes to be varied in response thereto.

Abstract: Apparatus and methods are provided for efficiently and non-destructively determining the thermal properties of materials having arbitrary surface textures. Two regions of a sample are each contacted by respective pairs of probes, where each pair includes a first probe made of a first material and a second probe made of a second material. A voltage sensor is arranged between the two probes of each pair, and between the probes of the same material from each pair. Nodes connect the voltage sensors to the probes. A temperature gradient is established between the two regions, while the nodes are maintained at a constant temperature. The Seebeck coefficient of the material and the temperatures of the regions can be determined from the voltages measured by the voltage sensors.