Abstract: The present disclosure provides systems and methods for content quasi-personalization or anonymized content retrieval via aggregated browsing history of a large plurality of devices, such as millions or billions of devices. A sparse matrix may be constructed from the aggregated browsing history, and dimensionally reduced, reducing entropy and providing anonymity for individual devices. Relevant content may be selected via quasi-personalized clusters representing similar browsing histories, without exposing individual device details to content providers.

Abstract: Systems and methods for facilitating shared access-right evaluation using linked communication channels are provided. A first communication can be received over a first communication link from a first user device, and a second communication can be received over a second communication link from a second user device. The first and second communications can include requests for the assignment of access rights. Map data can be generated and transmitted to each of the first and second user devices. Each user device can display a visual representation of access-right data. Further, a communication session can be facilitated between the first user device and the second user device. The communication session can be presented on the visual representation for each user device so that the first user and the second user can collaboratively evaluate access rights.

Abstract: A system for illuminating a body orifice includes: a frustoconical optical waveguide speculum includes a distal end, a proximal end wider than the distal end, an at least partially circumferential body wall having a bore passing between the proximal and distal ends of the speculum; and a base that couples to the speculum and receives a light source such that the speculum is configured to propagate light from the light source along the body wall. In a preferred embodiment, the body wall defines between an inner and outer surface of the body wall a fluidic channel configured to delivery fluid to the distal end of the speculum and a suction channel configured to drain fluid from distal end of the speculum.

Abstract: A system for illuminating a body orifice includes: a frustoconical optical waveguide speculum includes a distal end, a proximal end wider than the distal end, an at least partially circumferential body wall having a bore passing between the proximal and distal ends of the speculum; and a base that couples to the speculum and receives a light source such that the speculum is configured to propagate light from the light source along the body wall. In a preferred embodiment, the body wall defines between an inner and outer surface of the body wall a fluidic channel configured to delivery fluid to the distal end of the speculum and a suction channel configured to drain fluid from distal end of the speculum.

Abstract: A communication receiver (30) includes a data receiver (34) that receives a pulse-position modulated signal (38). A clock circuit (70) separates a reference clock signal (36) into multiple coordinating clock signals A, B, and C. Multiple time integrators (78) are gated to generate multiple time-integrated signals in response to the pulse-position modulated signal (38) and the coordinating clock signals A, B, and C. A combiner (96) forms a demodulated signal from the time-integrated signals IntA, IntB, and IntC.

Abstract: Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.

Abstract: Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.

Abstract: Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.

Abstract: A communication receiver (30) includes a data receiver (34) that receives a pulse-position modulated signal (38). A clock circuit (70) separates a reference clock signal (36) into multiple coordinating clock signals A, B, and C. Multiple time integrators (78) are gated to generate multiple time-integrated signals in response to the pulse-position modulated signal (38) and the coordinating clock signals A, B, and C. A combiner (96) forms a demodulated signal from the time-integrated signals IntA, IntB, and IntC.

Abstract: Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.

Abstract: Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.